Table of Contents

Solid State Technology

Year 2002
Issue 12


Think Tank

Think Tank


XinTec Expands Shellcase CSP Technology

SCHÄRDING, AUSTRIA — EV Group (EVG), a manufacturer of various wafer processing equipment, completed another equipment purchase agreement with XinTec Inc. of Taiwan.

The Changing Role Of The

The Changing Role of the Materials Supplier

Electronics packaging materials suppliers traditionally have functioned as developers of continuously evolving formulations that enhance both component and assembly performance and reliability.


The Year of Living Dangerously

Here we are at the end of 2002, at pretty much the same point we were at the end of 2001?having survived a very difficult year and assuming/hoping that business would be better by about the middle of the following year.


Special Report Wafer Lev

Wafer-scale Encapsulation: Controlling MEMS Packaging Costs

Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products.

Special Report Wafer Lev

Industry experts speak on WLP and co-design

The editors of Advanced Packaging and Solid State Technology magazines conducted an exclusive survey of key figures in the semiconductor manufacturing industry. We gathered input on two critical areas of front and backend convergence ? WLP and chip/package co-design. Following is what the industry experts had to say.

Molding Simulation.html

Molding Simulation

Predicting voids and unbalanced mold flow

Quality System Requireme

Quality System Requirements

Changes affecting the semiconductor supply chain

Hot Bottomceramic Packag

Revisiting An Old Packaging Approach