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Solid State Technology
New Tessera Stacked Packages
SAN JOSE, CALIF. — Tessera Technologies developed a package stacking technology that addresses business and logistical issues created by multichip integration.
Ceramic Packagings Long
Ceramic Packaging's Long Road
Packaging markets have come full circle over the past 40 years. In the 1960s, thick- and thin-film hybrid technology addressed, in part, limitations of integrated circuit (IC) technology.
Editors and other people with the luxury of observing and commenting have been exhorting the packaging part of the semiconductor industry to work more closely with the front-end portion of it.
Step By Step
Wafer-level Packaging and Test, Technologies and Trends
The term "wafer-level packaging" (WLP) entered the microelectronics industry's lexicon in the late 1990s.
Optical Inspection Of Cs
Optical Inspection of CSPs
Until recently, X-ray technology was the only option for inspecting hidden solder joints on chip scale packages (CSP).
Bga Solder Joints.html
BGA solder joints
Plastic ball grid array (BGA) packages have gained popularity because of trends in product miniaturization and enhanced in-package electrical performance.
Stressed Metal Nanosprin
Stressed Metal Nanosprings
A critical area of microtechnology is the mechanical stress of thin films. Generally, the goal is to keep the stress as low as possible for providing durable and reliable film stacks.