Table of Contents

Solid State Technology

Year 2002
Issue 7


Think Tank

Think TANK

Tom bought black and white tiles, 12 x 12-inches each, to lay on his square patio deck. He planned to have a perfect square of black tiles in the center of the deck with a border of white tiles around it


Kyocera combines copper conductors and alumina ceramic

Kyocera Corp. has developed a new ceramic packaging technology that combines features of low-temperature co-fired ceramics (LTCC) with tradition alumina ceramics.


Database for die products

To assist design engineers working with bare die, the Die Products Consortium (DPC) has created a database of information on available die products


Shake-up in probe card suppliers

There was significant motion in the ranking of probe card suppliers in 2001, according to a report from VLSI Research Inc


Wafer handling partnership for Adept and DEK

Adept Technology and DEK have announced a partnership to develop a fully automated wafer handling system for DEK's screen printer wafer bumping and ball placement system


STATS licenses ITRI Technology, introduces new PBGA

ST Assembly and Test Services (STATS) has licensed a heat dissipation technology developed and patented by the Industrial Technology Research Institute (ITRI)


China update: K&S, Intel making progress

Intel has announced plans for a $100 million expansion of its Pentium 4 assembly and test facilities in Shanghai. It reported that work would be completed on the plant this year, as part of a $500 million investment in facilities in China


Novel processes at IMAPS Garden State symposium

The Garden State Chapter of the International Microelectronics and Packaging Society (IMAPS) held its Spring Packaging Symposium in May where companies provided the latest updates on their new advanced packaging technologies

Feature Products

Semicon West Products

For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit


Advanced Packaging added to Chemical Abstracts Service

The American Chemical Society has selected Advanced Packaging for inclusion in its Chemical Abstracts Service (CAS)


MEPTEC optoelectronics update

MEPTEC held its second optoelectronics symposium in April. The symposium, entitled "The Opto-Mystic Industry," had a smaller crowd than last year's standing-room-only event.


CSPs, stacked packaging proliferate

Several announcements by major semiconductor manufacturers indicate the extent to which advanced packaging technologies have permeated mainstream products


UTAC establishes US design center

United Test and Assembly Center (UTAC) is setting up a package design center in Pleasanton, Calif., to support the design needs of customers in North America


Packaging defines products

Last month I had the good fortune to have a lengthy chat with the leadership of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society during ECTC

Industry Voices

Understanding the value of patents

Patents are becoming increasingly important to the electronics packaging industry. The number of patents in new packaging technology is growing by more than 40 percent per year


The Back End Process Ste

The back-end process: Step 7 - X-ray inspection

Flip chip challenges

Emi Filter Packaging.htm

EMI filter packaging


Flexible Flip Chip.html

Flexible flip chip

Solutions for high-performance applications

Die Products.html

die products

Standards provide key to progress

Reliability Of Bga Solde

Reliability of BGA solder bumps

Moiré interferometry evaluates shock and vibration performance

10th Anniversary Insight

10th Anniversary Insights
New (?) and emerging (?) technologies

Today, packaging and assembly of integrated circuits (ICs) can be characterized as an aggressive ongoing development effort