Think Tank Celebrates 10 Years!
K.H. "Wicks" Wickremasinghe has been writing Think Tank challenges for AP for 10 years now, and we'd like to commemorate the anniversary by telling you about the man behind the puzzles
Notes From The Floor
There has been a profound shift in paradigm in regard to multinational corporations (MNCs) and their foreign subsidiaries during the past 10 years
Moving automation from the front end to the back end
Twenty years ago, there was little focus on software and automation in wafer fabrication. The frontiers of science were being pushed back to keep up with Moore's Law and enabling technologies were bound to succeed
This year APEX will be held January 20-24, 2002, at the San Diego Convention Center. To help our readers prepare for the show, we're offering a preview of products and technologies that will be exhibited
Today's artificially intelligent systems are fabricated using sub-micron scale devices in micro- and meso-scale packages, primarily using electronic signals and the logic of programming to interface to the macroscopic world
MicroScale begins bumping services in Korea
MicroScale Co. Ltd., Korea's largest chip bumping house, has begun to operate a bumping line for semiconductor chips
IMAPS Workshop Report
IMAPS held its third Advanced Technology Workshop on "Packaging of MEMS and Related Micro Integrated Nano Systems" in early November in Scotts Valley, Calif.
The Meptec And Advanced
The MEPTEC and Advanced Packaging Technologists of the Year Award
The Third Annual Microelectronics Packaging Technologist of the Year Award, sponsored by the Microelectronics Packaging and Test Engineering Council (MEPTEC) and Advanced Packaging magazine, was presented in October during a special MEPTEC luncheon
Advancements in acoustic microscopy
Builders of high reliability systems that incorporate commercial off-the-shelf (COTS) components can enhance system reliability by using a new type of acoustic microscope system developed by Sonoscan Inc.
Boeing introduces automated MEMS aligner
The Boeing Company has engineered a MEMS device and soldering technique that provides rapid and precise alignment of single-mode optical fibers to laser sources, photodetectors and other single-mode optical fibers
JEDEC announces lead-free definition
JEDEC has recently approved a definition for lead-free solid state devices, which is "a solid state device that contains no more than 0.2 % by weight of elemental lead (Pb)
We take great pleasure this year in celebrating the 10th anniversary of Advanced Packaging. Yes, it was way back in 1992 when AP hit the streets