Table of Contents

Solid State Technology

Year 2002
Issue 1


Think Tank

Think Tank Celebrates 10 Years!

K.H. "Wicks" Wickremasinghe has been writing Think Tank challenges for AP for 10 years now, and we'd like to commemorate the anniversary by telling you about the man behind the puzzles

Notes From The Floor

Subsidiary evolution

There has been a profound shift in paradigm in regard to multinational corporations (MNCs) and their foreign subsidiaries during the past 10 years

Industry Voices

Moving automation from the front end to the back end

Twenty years ago, there was little focus on software and automation in wafer fabrication. The frontiers of science were being pushed back to keep up with Moore's Law and enabling technologies were bound to succeed

Product Roundups

APEX Preview

This year APEX will be held January 20-24, 2002, at the San Diego Convention Center. To help our readers prepare for the show, we're offering a preview of products and technologies that will be exhibited

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Anniversary Insights

Today's artificially intelligent systems are fabricated using sub-micron scale devices in micro- and meso-scale packages, primarily using electronic signals and the logic of programming to interface to the macroscopic world


MicroScale begins bumping services in Korea

MicroScale Co. Ltd., Korea's largest chip bumping house, has begun to operate a bumping line for semiconductor chips


IMAPS Workshop Report

IMAPS held its third Advanced Technology Workshop on "Packaging of MEMS and Related Micro Integrated Nano Systems" in early November in Scotts Valley, Calif.

The Meptec And Advanced

The MEPTEC and Advanced Packaging Technologists of the Year Award

The Third Annual Microelectronics Packaging Technologist of the Year Award, sponsored by the Microelectronics Packaging and Test Engineering Council (MEPTEC) and Advanced Packaging magazine, was presented in October during a special MEPTEC luncheon


Advancements in acoustic microscopy

Builders of high reliability systems that incorporate commercial off-the-shelf (COTS) components can enhance system reliability by using a new type of acoustic microscope system developed by Sonoscan Inc.


Boeing introduces automated MEMS aligner

The Boeing Company has engineered a MEMS device and soldering technique that provides rapid and precise alignment of single-mode optical fibers to laser sources, photodetectors and other single-mode optical fibers


JEDEC announces lead-free definition

JEDEC has recently approved a definition for lead-free solid state devices, which is "a solid state device that contains no more than 0.2 % by weight of elemental lead (Pb)


Time flies

We take great pleasure this year in celebrating the 10th anniversary of Advanced Packaging. Yes, it was way back in 1992 when AP hit the streets


Step By Step

The back-end process: Step 1 - Package design

As semiconductor devices become significantly more complex, designers are challenged to fully harness their computing power

Functional Tuning Of Hyb

Functional tuning of hybrids

Functional laser tuning of traditional ceramic-based hybrid circuits has been accomplished with the use of a standard 1.064-µm wavelength Nd:YAG laser for more than two decades

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Die Traceability

Strip packaging and wafer-level packaging (WLP) are now making packaging and final test more like fab processing

Cleaning Laser Debris Fr

Cleaning laser debris from TAB circuits

The formation of carbon residue while UV lasers drill microvias in polyimide or other dielectric materials is normal and expected

Next Generation Packagin

Next-generation packaging for fiber optics & MEMS

Next-generation packaging for fiber optic and MEMS modules will require improved levels of mechanical, thermal and environmental stability combined with increased capability to integrate electrical and optical functions

Packaging Of Fiber Colli

Packaging of fiber collimators

Packaging and assembly still dominate the overall cost of any fiber optic devices,1 largely because fiber optic alignment and attachment are difficult and time consuming