Table of Contents

Solid State Technology

Year 2003
Issue 9


Advanced Packaging Award

AP Award Program Sees Another Successful Year

Innovation again took center stage at Advanced Packaging's 2003 Advanced Packaging Awards Ceremony, held July 16 in conjunction with SEMI and the back-end portion of SEMICON West.

Advanced Packaging Award

Award Winners

Data Bank

Data Bank

Global semiconductor sales reached $12.54 billion in June 2003, up slightly from the $12.49 billion in revenue reported in May 2003.

Packaging Trends

The Revival of Vertical Manufacturing

A number of years ago when I became involved in electronics manufacturing, many of the large companies that dominated the marketplace, such as IBM, Motorola and Xerox, operated as "vertically integrated" organizations.




Onward and Upward

Generally, companies save their exciting new product introductions for the major trade shows to make the biggest industry splash possible.


The Back End Process

Meet Demand With Optoelectronics Software

There was a time when electronics manufacturers focused most of their efforts on developing ways to increase production capacity to meet consumer demand.

Getting Your Sip To Mark

Getting your SiP to Market

There are almost as many definitions of system-in-package (SiP) as there are companies manufacturing them. For the sake of clarity, this article defines SiP as a single package having one or more ICs plus passives with multiple interconnections.

Case Study

Thermal and Stress Simulations

To simplify the thermal management task facing customers, every chip released must meet tough internal performance specifications. But it is difficult to determine the thermal performance of a new design without actually building and testing it, which normally does not occur until relatively late in the design cycle.

Solder Ball

Solder Ball Endurance

Ball shear strength alone does not guarantee a reliable package. By design, ball grid array (BGA) and chip scale package (CSP) device families have to overcome repeat temperature extremes and environmental conditions.

Automating Military Hybr

Automating Military Hybrids and Microwave Module Assembly

Military hybrids and microwave devices are a distinct subset of microelectronics assembly. Because these devices emphasize power, reliability and robustness in harsh operating environments, assembly techniques require a high level of precision, particularly in the areas of dispensing epoxy and handling die.

Cover Story

Design your own ASIC

The potential of 90 nm application-specific integrated circuit (ASIC) designs is introducing new packaging challenges that threaten the IC designer's ability to take full advantage of this advanced process technology.