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Solid State Technology
Remember when you first set off to college? Every assignment was an excuse to learn as much as you could about a subject, then to use what you learned in a creative way.
In the News
SEZ Group Focuses on Single-wafer Technology
Semiconductor Packaging Grows While Industry Lags
While relatively unnoticed, the packaging industry has been slowly but steadily growing over the past 18 months.
Pyramids, Purgatory and 76 Trombones
We humans are fascinated with eternity. In books, movies or our portfolios, we are always looking for the perfect long-term solution.
Worldwide semiconductor revenue
Bond Testing Uncovered C
Bond Testing Uncovered: Current and future technologies
As the age of miniaturization advances, the need to check the integrity of interconnects becomes ever more demanding.
Prototype Packaging Solu
Prototype Packaging Solutions for IC Designers
Being the first to market with new integrated circuit (IC) designs is essential to the survival of a fabless company, and it is significant to the growth of established semiconductor manufacturers.
The Back End Process
Wafer Bumping for Flip Chip Attach
There are five commonly used methods of wafer bumping for flip chip attach, three of which are challenging and expensive: Stud bumps formed by ball bonding using gold wire; plated gold bumps using electrolytic or electroless gold; and plating solder bumping by electrolytic or electroless solder plating.
Cover Story Flip Chip An
Cover Story: Flip Chip and BGA Solder Joint Reliability
The trend in flip chip and ball grid array (BGA) packages to increase I/O counts drive the interconnecting solder joints to be smaller in size and, thus, have higher current density.