Table of Contents

Solid State Technology

Year 2003
Issue 4


Data Bank

Data Bank

Data Bank

New Products

New Products

New Products

Packaging Trends

Sub-contractor Update: Mixed Bag in 2002 Revenue

The assembly and test sub-contracting business made a decent rebound in 2002, but the nature of the bounce varied somewhat at the major sub-contractors.

Industry Voices

Cost and Quality in Today's Electronics

Last Christmas we read reports of jammed mall parking lots yet poor retail sales.


Getting to Know You

Many of you may already know me, perhaps under the name of Gail Stout, since I've been the editor-in-chief of SMT Magazine for many years.


In The News

KYOTO, JAPAN— The 16th Annual International Conference on Microelectromechanical Systems (MEMS), sponsored by IEEE and the Robotics and Automation Society was held at the Kyoto International Conference Hall in Kyoto, Japan from January 19 to 23, 2003.


The Back End Process

Soft Solder Die Attach

Power microelectronics devices generally are used in automotive packages in which the current-flow density is high. If not dissipated properly, the heat generated by high current densities can damage the package.

Ltcc On Metal.html

LTCC on Metal

Designers of today's high-performance components, modules, circuit boards and systems with higher operating frequencies and thermal management requirements face difficult design problems, many of them associated with circuit and system packaging.

Green Mold Compound.html

Green Mold Compound

With the electronics industry driving for cost reduction, miniaturization and functional integration, the conventional integrated circuit (IC) package design is forced to migrate to finer wire bonding pad pitches, from 90 to 60 µm, or even 35 µm staggered pitch

Cover Story Bare Chip St

Cover Story: Bare Chip Stacking

Throughout the electronics industry, it is always desirable and sometimes imperative to improve circuit packaging density. This is particularly true in the areas of avionic and satellite electronic packaging.