Table of Contents

Solid State Technology

Year 2003
Issue 2



MEMS/MST Market to Cross $26 Billion by 2007

According to an updated report from Business Communications Co. Inc., ....



System On Chip In Packag


System-on-chip (SOC) design and fabrication technology is beginning to provide single-chip wireless products.

New Products

New Products


Simplicity of Selling?

One of the very few constants this time of year is Girl Scout Cookies. While many of us have peered over our shoulders and stared down declines in markets that would have been unheard of just two years ago, one simple constant remains.


Jet Vapor Deposition.htm

Jet Vapor Deposition

Gold/tin solders have low melting points, high-yield strengths and good oxidation resistance.

Solder Ball

Solder Ball Endurance

Ball shear strength alone does not guarantee a reliable package.

Microdot Dispensing.html

MicroDot Dispensing

The commercial marketplace is driven by consumer demand. Today, that demand focuses on the delivery of feature-rich devices.

Stacked Package Delamina

Stacked Package Delamination

An advanced chip stacking technology has been developed recently in response to the requirements of the consumer electronics market.1,2