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Solid State Technology
The Expanding Role of Wafer-level Processing
Five years ago the promise of wafer-level processing for advanced packaging meant improved performance, reduced form factor, and the potential of reduced packaging costs.
Organizing Electronics Worldwide
I recently put together a panel of experts to discuss the concept of "jisso," and what the Jisso North American Council hopes to accomplish.
In the News
Outsourced Assembly and Test
At Amkor, we are addressing opportunities to expand the outsourced semiconductor assembly and test (OSAT) industry.
Advanced Packaging Techniques Impact High-energy Physics Research
Scientists at the Fermi National Accelerator Laboratory (Fermilab) are working on a new major high-energy physics project, the BTeV (B physics at the Tevatron) experiment.
The Back End Process
Test, Assembly, and Packaging: Benefits of Automation
Total factory automation in test, assembly, and packaging (TAP) facilities has changed very little over the last decade.
Impact Of Flip Chip On F
Impact of Flip Chip on Flex Processes
Best-In-Class Product Density at Minimum Cost and Maximum Production Rates
Packaging Optoelectronic Components
An Emerging Model
Embedded Passives Rf Des
Embedded Passives, RF Design
Overcoming Mixed-Technology Design Challenges
Flexible Hybrid Die Atta
Flexible Hybrid Die Attach
Flexibility is key when it comes to die attach capabilities critical for hybrid microelectronics, especially in North America's automotive, medical and military markets.
Fabrication of Wafer-level Nano-optics
"Embossing" is an ancient technical term in the English language, traceable to the period 1350 to 1400, and used by Chaucer in its present sense.