Table of Contents

Solid State Technology

Year 2004
Issue 8



In the News

Editorial Board

The Time Machine and Its Lessons

About 10 years ago, I held an aluminized silicon wafer in hand, curiously regarding a dull, non-reflective square covering most of the surface.

Industry Voices

Lead-Free Assembly: Greatest Shake-up is Yet to Come

For component producers to respond successfully to the challenges of the lead-free era, material suppliers must do more for customers than many have even considered or are able to deliver.

Packaging Trends

Subcontractor Update: Cooling Trend to Start in 2004

While the numbers were generally positive for the assembly and test subcontractors in the first quarter of 2004, the industry cooled off somewhat to start the year.

New Products

New Products


What's up with Flip Chips?

On June 21 in Austin, Texas, I moderated a panel for the Global Business Council (GBC) of IMAPS covering the global flip chip business overview.


The Back End Process

Stacked-die Packaging: Technology Toolbox, Step 8

Wireless applications such as cell phones and consumer products like pocket PCs require maximum functional integration in the smallest footprint, lowest profile and low-cost packaging.

Cover Story

Bond Test Fundamentals for Successful Advanced Applications

In today's technology press, you do not hear much about bond pull and shear testing.

Investigation Of Lead Fr

Investigation of Lead-free Package Reliability

A new, reliable material is essential

Technologies For Microde

Technologies for Microdevice Packaging

Packaging Requirements for MEMS and MOEMS