Equipment for Advanced Packaging
As an enabling technology, automated microelectronic and photonic manufacturing equipment is the engine that propels today's product concepts from the laboratory into large-scale commercial, military and industrial prominence.
Evolution of Wafer-level Packaging
Sandia National Laboratories and Fujitsu conceived the wafer-level package (WLP) in the mid 1990s.
Semicon West Products
SATS Outsourcing Growth Is Blossoming
Last week, the Microelectronic Packaging and Test Engineering Council (MEPTEC) held what it hopes to be the first of many semiconductor assembly and test services (SATS) investor conferences.
Who Will Regulate Lead-free Compliance?
We all know that you can do well by doing good, right? When it comes to lead-free, many advanced packaging OEMs have already made an announcement of compliance.
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