Table of Contents

Solid State Technology

Year 2004
Issue 6


Editorial Board

Applying Moore's Law to Wafer Test

Gordon Moore's 1965 observation that the number of transistors per square inch of silicon was doubling every year has, with modest variations, continued to characterize growth in the semiconductor industry.

Packaging Trends

Overcoming Tin Whisker Problems on Lead-free Packaging

The EU has set in place a Restriction of Hazardous Substances (RoHS) directive that states: "Member States shall ensure that from July 1, 2006, new electrical and electronic equipment put on the market does not contain lead (Pb), mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers."

New Products

New Products

Industry Voices

New Lead-free Processes Require Industry Collaboration

The electronics industry is making steady progress toward developing lead-free assembly processes to meet the EU's Restriction on Hazardous Substances (RoHS) directive, which calls for the elimination of lead and other hazardous substances from new electrical and electronic equipment by July 2006.

Notable Developments

Optical Circuit Packaging Technology

To serve a new seamless telecom and multimedia communications society, the smooth, fast, intelligent transmission and processing of large data files is necessary.


Intel: Challenges of Leadership

Have you ever been in a foot race?


In the News


Bond Testing Bumped Devi

Bond Testing Bumped Devices

Test methodology considerations

Variable Flip Chip Assem

Variable Flip Chip Assembly for High-volume Production

Solder bump and adhesive flip chip advantages

The Back End Process

Underfill Update, Step 6

Materials and Processes

The Value Of Ic Package

The Value of IC/Package/System Co-design

Blending engineering knowledge across IC/OSAT/OEM companies

Cover Story

Next-generation Packaging Materials

New developments in board/package materials and processes