Table of Contents

Solid State Technology

Year 2004
Issue 5


Editorial Board

The Changing Automotive Environment: High-temperature Electronics

In 1977, the average automobile contained $110 worth of electronics. By 2003, the electronics content was $1,510 per vehicle. This is expected to reach $2,285 by 2013.


London Bridges

Late in March, Advanced Packaging's editors and publisher arrived at Windsor Castle Hotel in Windsor, England for a "Meet the Editors" Reception.


In the news

Packaging Trends

Subcontractor Update: Growth Everywhere

All of the numbers were positive and growing at the major assembly and test subcontractors at the end of 2003. Each of the eight companies covered here had increased revenue in the fourth quarter, a profit to report, and higher revenue for the year compared to 2002.

Industry Voices

Criteria for Success in SATS Mergers and Acquisitions

We know this is a fragmented industry, an asset-intensive industry, and we just emerged from the worst industry downturn.

New Products

New Products


The Future Of Package De

The Future of Package Design

Design collaboration is key

The Back End Process

Bump Arrays for RF Applications: Step 5

Modeling Methodology

Strain Analysis Of Pqfp

Strain Analysis of PQFP Packages

Digital image correlation metrology technology

Cover Story

Logic and Memory Package Integration

Addressing technical and logistical challenges

Wafer Level Hermetic Cav

Wafer-level Hermetic Cavity Packaging

Potential cost, handling and performance advantages