|Table of Contents|
Solid State Technology
RF SoP for Multi-band RF and Millimeter-wave Systems
Miniaturization, portability, cost and performance are the primary challenges in wireless systems.
The Worth of a Professional Packaging Society
Your competitor offers a new plastic-packaged assembly that can replace one of your main income-producing products at a price slightly higher than yours.
So You Want to Do Business in Asia...
Many companies in electronics are moving operations to Asia with mixed results. Therefore, we spent time talking to a few in the back-end assembly side to see what precipitated their actions.
In the News
The Back End Process
Die Attach in Lead Frame Packages: Step 4
Although much of the buzz in the industry surrounds newer high-tech packages such as ball grid array (BGA), chip scale packages (CSP) and flip chips, the foundation of modern electronics is the lead frame package.
Ultraviolet Laser Based
Ultraviolet Laser-based MOEMS and MEMS Micromachining
Ultraviolet (UV) laser micromachining of microelectromechanical systems (MEMS) and micro-optoelectromechanical systems (MOEMS) is emerging as a viable, and often preferable, alternative to wet processing and other methods, thanks to its speed, accuracy and simplicity.
Cooling Ic Packages In R
Cooling IC Packages in Restricted Enclosures
More ICs are being used in tighter spaces and increasing numbers of ICs are approaching or exceeding their operating temperature limits.
Trends In Wafer Level Pa
Trends in Wafer-level Packaging of MEMS
Microelectromechanical systems (MEMS) are miniaturized systems with electrical and non-electrical components.
Advances in MEMS Packaging
The microelectromechanical systems (MEMS) component market size is forecasted to continue growing over the next few years. This article presents design considerations to provide a better understanding of the unique challenges facing MEMS packaging engineers, when compared to traditional IC packaging. Automatic MEMS assembly requires optimized equipment and processes.