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Solid State Technology
SEMICON Taiwan 2005 Product Preview
Semiconductor Assembly and Test Providers: The New Technology Frontier
As device manufacturing continues down the path of smaller geometries and increased densities laid out by Moore’s law, the importance of packaging technology to the overall performance of the device continues to grow in parallel.
Package-on-Package Space Savings with Flexibility
Today’s consumer electronics demand higher performance from smaller form factors.
A Look at IMAPS
There are just so many tradeshows that you can attend each year, but if you have to choose just a few for back-end assembly, SEMICON West and IMAPS should be high on your list.
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