Table of Contents

Solid State Technology

Year 2006
Issue 11



Museum Hosts Anniversary Party

MOUNTAIN VIEW, CA - To commemorate the 35th anniversary of the 4004 Intel microprocessor, the Computer History Museum and the Intel Museum hosted a night of history and discussion, November 13, 2006.

Trade Show Floor

IMAPS Symposium in Review

I like going to the IMAPS International Symposium, held this year Oct 9-14 in San Diego.

Packaging Trends

Choosing the Right Sorbent for Electronics Applications

Maintaining the stability of moisture-sensitive electronic components and assemblies is a fundamental concern of manufacturers.

Editorial Board

The Perils of RoHS

There is growing evidence that the RoHS directive banning lead solders in electronic equipment has fallen victim of the Law of Unintended Consequences.


Interview with EOPlex

It wasn’t exactly the Roadshow, but I visited a fascinating start-up company and spoke with Arthur Chait, CEO; and Anwar Mohammed, VP of manufacturing and operations, about EoPlex Technologies, headquartered in Redwood City, CA.


Joe Fjelstad Releases Flexible Circuit Technology, 3rd Edition

SEASIDE, OR - The third edition of Flexible Circuit Technology features new technologies and applications that have developed over the eight years since the second edition was published.


International Consortium Forms around TSV

KALISPELL, MT - Through-silicon vias (TSVs) are pivotal in thermally conscious packaging, and a budding consortium pledges to address the technical and cost issues of creating 3-D interconnects using TSV technology for chip stacking and MEMS/sensors packaging.


Freescale Packages Hit 30 Million Mark

AUSTIN, TX - Freescale Semiconductor announced they have shipped over 30 million high-power laterally diffused metal oxide semiconductor (LDMOS) radio frequency (RF) transistors in over-molded plastic packages.


Hesse & Knipps Names Senior Field Service Engineer

SAN JOSE, CA - Hesse & Knipps, Inc., fully-owned subsidiary of German Hesse & Knipps GmbH Semiconductor, has appointed Guill Muyot as senior field service engineer.


Dare to Share

It’s amazing how much you learn when you reach out to others. My father often told me figuring out what I would do with my life was a quandary to him.

Advanced Packaging Road

Born To be Wild

Get your motor running, head out on the highway - looking for adventure, and whatever comes your way Gail Flower, editor-in-chief gets a ride from Dick Schedtler, VP AR Marketing.


The Back End Process

Ribbon Wire Bond Testing

Semiconductor assembly and packaging process engineers routinely face pressures of evolving technology requirements such as lead-free compliance, product introductions, and customer demands for quality.

Developing Mems For Mari

Developing MEMS for Marine Sensors

MEMS is an enabling technology allowing for the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications.

Tin Pest In Tin Rich Sol

Tin Pest in Tin-rich Solders

Tin is a common component of solders because of its desirable properties such as low melting point, high diffusivity, low surface tension in the liquid phase, and others.

Cover Story

Innovations in Computer Tomography

Advanced 3-D packages are replacing leadframe packages with the emergence of more subsystem integration, strengthened by advances in wafer-level technology.

Avoiding The Flux Free Z

Avoiding the Flux-free Zone

Surface preparation prior to metallurgical bonding ensures a strong intermetallic formation of soft solder and various surfaces.