Solid-state Memory Growth for Packaging
The removable solid-state storage (RS3) market posted strong growth in 2005, as consumer demand for flash cards and universal serial bus (USB) flash drives continued.
Tessera and Flextronics Sign Licensing Agreement for Shellcase CF
SAN JOSE, CA - Further paving the way into the consumer optics arena, Tessera announced the first licensing agreement for their wafer-level image sensor packaging technology, Shellcase CF, to Flextronics International Ltd.
SMIC Forms Design Partnerships
SHANGHAI, China - Verisilicon Holdings Co., Ltd., an ASIC design foundry, semiconductor library, and intellectual property (IP) provider, along with Semiconductor Manufacturing International Corporation (SMIC), will release a standard design platform (SDP) for 0.13-μm low-leakage processes.
Actel Appoints Nordic FAE
MOUNTAIN VIEW, CA - Actel Europe announced the addition of Rouzbeh Hosseinalikhani as a field applications engineer (FAE) to its Nordic and Baltic regions support staff.
Thin-film Batteries Attract Funding
GOLDEN, CO - To build high-volume manufacturing facilities for its proprietary thin-film batteries, Infinite Power Solutions (IPS) attracted funding from existing and new corporate investors.
Lead-free Impact on X-ray Inspection
With the July 2006 deadline for the European Union’s (EU’s) RoHS and WEEE directives past, it’s interesting to observe the long-term impact of lead-free implementation upon X-ray inspection.
New Packaging Concept for Ultra-thin Chips
Bendable chips are a key component of future smart systems such as smart textile and flexible displays.
Dage’s computerized tomography (CT) option for digital X-ray inspection systems uses a digital geometric process to generate a 3-D image model from a series of individual 2-D X-ray image “slices” taken around a single axis of rotation.
Peptides, Carbon Nanotubes Team Up
TEMPE, AZ - Motorola Labs and Arizona State University (ASU) have co-developed a coating process that allows chemical-detecting peptides to alert single-walled carbon nanotubes (SWNTs) to the presence of heavy-metal ions at the parts-per-trillion level.
Taking Care of Business and Working Overtime
How often have we heard, “Nothing personal; I know it’s not right, but it is good business”? To that I say, “No way.
Advanced Packaging Road
We love New York!
Our first stop in New York was to Endicott Interconnect, where we learned about organic build-up substrates.
Intel Begins Restructuring
SANTA CLARA, CA - In an overview of its restructuring plan for the long-term future, Intel detailed reductions in workforce, merchandising expenses, capital, and materials.