Table of Contents

Solid State Technology

Year 2006
Issue 7


Editorial Board

SoC vs. MCM vs SiP vs. SoP

IC integration to system-on-a-chip (SoC) continues to be the dream of all semiconductor companies.

Industry Voices

Technology Flows Downhill

When thinking about design and fabrication technologies deployed for integrated circuit (IC) and printed circuit board (PCB) products, a common axiom is that “technology flows downhill.”.

Advanced Packaging Award

Advanced Packaging Awards Entry Showcase



In the News

With silver prices almost double what they were in the fourth quarter of 2005, materials costs are starting to be affected.

Packaging Trends

Mass Imaging Advances Deliver Speed, Control, and Flexibility

The blurring lines between SMT assembly and semiconductor packaging have been the topic of an ongoing debate for years.


Pre-commercial Insights

One of the most interesting aspects of advanced packaging comes from the excitement that engineers feel when they’re just about to introduce a new interconnect method, a unique package, or an application.

Advanced Packaging Road

Advanced Packaging: on the road again

We had such a great time, met such interesting people, and learned so much on our first Roadshow trip that we knew it was just the beginning of a great new element of Advanced Packaging.


Package On Package

Package-on-Package Trends and Technology

Destined for Growth

Wafer Dicing

Water-jet-guided Laser Technology

A Damage-free Dicing Solution

The Back End Process

Wire Bonding Considerations

Design Tips for Performance and Reliability

Cover Story

Flip Chip Technology

Mainstream At Last