Room-temperature Solder Bonding of Electronic Packages
Reactive bonding is a room-temperature process for soldering packages or components directly to boards without using a conventional solder reflow.
SEMICON West Product Preview
The AKU2000 surface-mountable complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) microphone integrates an acoustic transducer, output amplifier, and 4th-order sigma-delta modulator in a single chip.
PoP as a Preferred Packaging Solution
Package-on-package (PoP) has emerged asthe preferred 3-D packaging solution for integration of logic and high-performance memory devices in mobile multimedia products.
What, I Need a Package?
A typical phone call to a package manufacturer begins with: “I have this chip, what package do you have that will fit?” Next comes the basic questions: “What size is your chip? How many pads does it have? Does it need to be hermetic? Do you want it to be surface mountable? Leaded? Ball grid array? Oh, and by the way, how fast does your chip operate?” Depending on the answer to the last question, everything else becomes moot.
In The News
SAN JOSE, CA - In response to the success of Technology Innovations Showcase (TIS), SEMI has expanded the idea, introducing TechXPOTs to SEMICON West 2006, July 11-14 at the Moscone Center in San Francisco, CA.
Advanced Packaging Road
Advanced Packaging Hits the Road
Advanced Packaging thought it was time for a fresh look at what’s really happening in the semiconductor packaging industry, so we’ve hit the road.
Focus on Flip Chips
Don’t you just love being right? It took a long time for flip chips to go mainstream, but now that they have made it, it’s very satisfying.