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Solid State Technology
Flip Chip Interconnection Using Copper Wire Bumps
Various flip chip systems have been used for advanced packages, including chip scale packages (CSPs) and ball grid arrays (BGAs).
Achieving Ceramic Properties for Embedding Components in Organic Substrates
Ceramics’ unique properties such as low loss factor, high thermal stability, and hermeticity have secured their role for applications in RF, high-temperature, and high-reliability devices for decades.
Nanos Are Coming
It’s official - the nanos are coming. While not yet battering our packaging gates, they are within sight of our walls, and advancing rapidly.
Commonly Asked Lead-free Cleaning Questions
When considering cleaning lead-free residues, what needs to be asked first: must I, should I, can I, can I afford to, or can I afford not to?
APEX Showcases AP/SMT Synergy
There’s a lot of talk in the electronics industry about the blurred lines between advanced packaging (AP) and surface mount technology (SMT), and nowhere was that more apparent than on the trade show floor at the IPC Printed Circuits Expo, APEX, and the Designers Summit, held February 7-10, 2006, at the Anaheim Convention Center in Anaheim, CA.
That’s How It Stacks up
Throughout the electronics community, the accepted assumption is that packaging will save the industry.
In the News
Si Drie For Through Wafe
Si DRIE for Through-wafer Via Fabrication
An option for device-stacking applications
Streamlined Thermal Mode
Streamlined Thermal Modeling
The Back End Process
Wafer Processing with Short-pulsed UV DPSS Lasers
Expanding New Applications Development
Quality Control In Micro
Quality Control in Microelectronics
METROLOGY TOOLS PROVIDE SOLUTIONS
Breaking The Flip Chip P
Breaking the Flip Chip Pitch Barrier
Keeping up with electrical and mechanical requirements
Vacuum Bonding Technology Creates Long-term Stable IMUs
Until recently, micro-systems technology resonant-mode inertial measurement units (IMUs) have had limited lifetime.