Table of Contents

Solid State Technology

Year 2006
Issue 3


Editorial Board

Flip Chip Interconnection Using Copper Wire Bumps

Various flip chip systems have been used for advanced packages, including chip scale packages (CSPs) and ball grid arrays (BGAs).

Notable Developments

Achieving Ceramic Properties for Embedding Components in Organic Substrates

Ceramics’ unique properties such as low loss factor, high thermal stability, and hermeticity have secured their role for applications in RF, high-temperature, and high-reliability devices for decades.

Packaging Trends

Nanos Are Coming

It’s official - the nanos are coming. While not yet battering our packaging gates, they are within sight of our walls, and advancing rapidly.

New Products


Industry Voices

Commonly Asked Lead-free Cleaning Questions

When considering cleaning lead-free residues, what needs to be asked first: must I, should I, can I, can I afford to, or can I afford not to?

Think Tank

APEX Showcases AP/SMT Synergy

There’s a lot of talk in the electronics industry about the blurred lines between advanced packaging (AP) and surface mount technology (SMT), and nowhere was that more apparent than on the trade show floor at the IPC Printed Circuits Expo, APEX, and the Designers Summit, held February 7-10, 2006, at the Anaheim Convention Center in Anaheim, CA.


That’s How It Stacks up

Throughout the electronics community, the accepted assumption is that packaging will save the industry.


In the News


Si Drie For Through Wafe

Si DRIE for Through-wafer Via Fabrication

An option for device-stacking applications

Streamlined Thermal Mode

Streamlined Thermal Modeling

Reduces Time-to-Market

The Back End Process

Wafer Processing with Short-pulsed UV DPSS Lasers

Expanding New Applications Development

Quality Control In Micro

Quality Control in Microelectronics


Breaking The Flip Chip P

Breaking the Flip Chip Pitch Barrier

Keeping up with electrical and mechanical requirements

Cover Story

Vacuum Bonding Technology Creates Long-term Stable IMUs

Until recently, micro-systems technology resonant-mode inertial measurement units (IMUs) have had limited lifetime.