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Solid State Technology
Plans Are Nothing; Planning Is Everything
This well-worn axiom from a top military planner, General Dwight D. Eisenhower, describes the mindset necessary to survive and prevail in the melee of business.
Advanced Packaging Award
The APAs: Honoring Industry Innovation
In a ceremony on July 18, 2007, Advanced Packaging celebrated the 7th Annual APA awards.
Trade Show Floor
Back-end Processes Take Center Stage at SEMICON West
Whether the topic of discussion was yield management, reducing cost of production and test, the next area of industry expansion, or where a company is realizing the greatest revenue, back-end assembly and test was the focus at SEMICON West 2007.
In the News
Advanced Packaging Road
All That Glitters
Semiconductor Packaging Materials, Armonk, NY
At SEMICON West this year, steps towards efficiency, collaboration, and relationship-building were evident everywhere.
Solutions And Solvents F
Solutions and Solvents for Removing Silicone: A Practical Guide
Silicone adhesives are becoming more widely used in microelectronic hybrid assemblies due to their inherently low elastic modulus, which relieves stress between substrates with different coefficients of thermal expansion (CTE) during thermal cycling.
The Back End Process
Flux and Underfill Compatibility in a Lead-free Environment
Since their introduction nearly 20 years ago, the benefits of integrating flip chips into modern devices have been well proven.
Wafer Coating Advancemen
Wafer Coating Advancements for Packaging Applications
Demand for continuous reductions in semiconductor package height are coming from several directions, most notably memory chip vendors seeking increased density to meet aggressive price-performance roadmaps.
Single Wafer Surface Conditioning
The need for back-side metal adhesion and solder contact for ultra-thin, discrete, high-power semiconductor devices has increased significantly over the past several years.