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Solid State Technology
Extreme Environment Advancements
Extreme-environment electronics operate in conditions outside the parameters of mainstream electronics.
In the News
Semiconductor Packaging Outlook
s semiconductor technologies mature, keeping up with Moore’s Law becomes progressively tougher.
I’ve always thought that packaging was sexy.
Advanced Packaging Road
In the Wild, Wild West
Amkor Technology, Chandler, AZ
The Back End Process
Challenges in Flip Chip Assembly
Flip chip on substrate assembly has been a placid technical field, with a mainstream high-volume manufacturing process carefully shepherded by production engineers towards raising yields and increasing line throughput.
One of the most important measurements when designing an automated optical inspection (AOI) of solder bumps is bump coplanarity. Remarkably, the appropriate JEDEC specification (JESD22-B108A) defines bump coplanarity in a way that could give misleading results.
Handling Ultra Thin Wafe
Handling Ultra-thin Wafers
Manufacturing technologies for 50- to 150-µm thin wafers are a basic need for a wide variety of microelectronic products.
Thermally Conductive Adh
Thermally Conductive Adhesive Tapes
A well-designed thermal management system involves efficient heat-dissipating components such as heatsinks, air or liquid cooling pipes, and fans. To maximize heat dissipation, choosing the right thermal interface material (TIM) is critical.
Sockets Meet Future Tech
Sockets Meet Future Technology Challenges: Part II
In the March 2007 cover story, we asked the industry about the demands that new packages placed on sockets, lead-free issues, standards, cost control, fine pitch, and the overall consensus on the Burn-in & Test Sockets Workshop (BiTS) where users talk to suppliers.
Clip Bonding on High-power Modules
Increasing power levels and power density requirements for multiple end products means that high-power semiconductor modules and components are often assembled using a clip-bonding technology.