Technology Investment Strategies to Meet Future Product Needs
t the 2007 Consumer Electronics Show (CES), convergence, or the merging of PCs, TVs, cell phones, and other devices that enable access to diverse and growing content, was a key theme.
Meet the Press at BiTS
Attendees at the 8th Annual Burn-in Test and Sockets Workshop (BiTS), March 11-14 in Mesa, AZ, are invited to Advanced Packaging’s Meet the Press, March 12th at 5pm to learn about general market trends in the sockets industry.
API Diversifies with MEMS
TORONTO - API Nanotronics Corp. closed acquisition of National Hybrid Inc.
Synova Boosts Korea Presence
SEOUL, South Korea- Synova received tool orders from a Korea-based organic LED (OLED) manufacturer and a U.S.-based semiconductor manufacturer’s Korea facility.
Chips-first Approach to System-on-chip
System-on-chip (SoC) is a concept that has been proposed and, to some extent, introduced into the electronics marketplace.
3-D Integration Is the Way to Go
The need for system-size reduction, high-performance interconnects, and heterogeneous integration of true system-on-chip (SoC) is driving the packaging world towards 3-D chip integration.
“Can I Order a Double Stack?”
SINGAPORE - In a bid for the mobile handset market, STATS ChipPAC developed a method of stacking 3-D packages, creating a package-on-package (PoP) with up to seven stacked die.
The Thermal Management Equation
Theories on thermal management rival, in number and variety, strategies for winning the Super Bowl or baking the perfect loaf of bread.
Advanced Packaging Road
Practical Electronics 101
This issue of Advanced Packaging stands out for me because I had a chance to get to know more about practical issues that revolve around sockets.