Enabling Cooling Strategies for 3D packages
Riding on recent advances in nano-fabrication technology, thin-film thermoelectric coolers (TF-TEC) have been developed with active material as thin as 10-20 ??m.
In The News
Live from Orlando: Freescale’s Technology Forum
ORLANDO, FL —Everything about the Freescale Technology Forum Americas conference, held June 16 & 17, at the JW Marriott and Ritz Carlton Conference Center in Orlando, provided the attendee an opportunity to interact with the Freescale community.
Advanced Packaging Award
Advanced Packaging Award Finalist Showcase
Electromechanical Coating Processes eG ViaCoat enables the metallization of TSVs, until now a process that was holding back adoption of 3D packaging.
It’s About Time
What do you do when work doesn’t leave a moment to spare? You take a break to gain a new perspective.
Advanced Packaging Road
Northwest Passage Near Nature; Near Perfect
In one of the most beautiful areas imaginable in the Pacific Northwest amidst flowers and greenery, two companies do leading-edge research and development work that affects how electronics work.