Table of Contents

Solid State Technology

Year 2008
Issue 5


Editorial Board

Diversity and Standards

3D packaging has a bright future. It simply makes a lot of sense.

In The News

Sensata Technologies Develops a Latched Socket

ATTLEBORO, MA ??? Hideyuki Takahashi, Japan engineering manager, and Hide Furukawa, U.S. engineering manager at Sensata Technologies have developed a latch system for delicate IC packages.

Packaging Trends

Extending Leadframe Application Opportunities

Leadframe-based packages accounted for over 70% of the 147 billion IC packages produced in 2007.

Product Preview

Semicon West Product Preview


The Trouble with News

You would think that because I’m a National Public Radio junkie, news would be of vital importance to me – any type of news.

Exhibitor Spotlight

Who’s Who at BiTS, SEMICON China and IMAPS Device Packaging Symposium

The Advanced Packaging editors covered a lot of ground this spring as co-sponsors of the Burn-in and Test Socket (BiTS) Workshop in Mesa, AZ, attending SEMICON China in Shanghai, and the IMAPS Device Packaging Symposium in Scottsdale, AZ.


The Back End Process

Choosing the Best Bump for the Buck

Flip chip interconnect offers the advantages of smaller footprint on the PCB, improved electrical performance, reduced manufacturing steps at assembly, and excellent long-term reliability.

Inside 3d Packaging

Flash Memory for Stacked PoP Technology Issues and Test Challenges

Flash memory has become a fundamental building block in modern electronic systems.


Cleaning High-power Electronics A closed-loop SOlvent-Based Approach

Flux residues must be be removed from flip chip components prior to subsequent processes to prevent malfunctions in high-power electronics.

Cover Story

Creating Wireless SiP Solutions

While CMOS SoC works well in low power applications, it doesn't meet requirements for future wireless products.