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Solid State Technology
Elastic Interconnections for Stretchable Electronics
Although most electronic appliances are rigid, or at most mechanically flexible, future applications will require them to be flexible, stretchable, and offer maximum user comfort.
Package-on-package (PoP) with Through-mold Vias
Package on Package (PoP) stacking has become the preferred method for 3D integration of baseband ICs or ASICs with high-performance memory in mobile multimedia applications.
IN THE NEWS
STAMFORD, CT - A glut in the DRAM market, slower than expected growth in NAND spending, and concerns about a U.
I always associate quality with building a house. Because my dad was a contractor, each of his children learned about reading blueprints, controlling construction costs, choosing compatible materials, and measuring more than once before doing anything.
Advanced Packaging Road
Where the Back-end Begins
From a device manufacturing perspective, where the front-end leaves off and where the back-end begins has become a subjective point of reference; it really depends on the complexity of the device being manufactured.
Designing Modern 3d Pack
Designing Modern 3D Packages with Mixed Technology Content
Packaging technology has evolved over the years, transitioning into more of a revolution with the introduction of new packaging styles practically every month. Designers face designing extremely high-performance packages with mixed technology content such as high speed digital, analog, and RF.
Wire Bonding Process Con
Wire Bonding Process Control Targeting 100% Yield
Current methods of monitoring wire bond quality for both heavy and fine wire applications fall short of enabling the goal of 100% yield.
The Thermal Cpb An Appro
The Thermal CPB An Approach to Thermal and Power Management
In electronics, heat and power issues are gating progress; especially in high-end, flip chip devices.
2008 Packaging Drives Th
2008: Packaging Drives the Industry
This year’s forecast points toward healthy, confident growth in packaging.