The FD-SOI technology platform is perfectly suited for mobile IC applications where power consumption has to be very low to maximize battery lifetime. GIORGIO CESANA, STMicroelectronics, Crolles, France and CARLOS MAZURE, Soitec, Bernin, France
A broadband polarized reflectometry measurement, utilizing RCWA analysis, can be used to obtain detailed trench profile results. FRANZ HEIDER, Infineon Technologies, Villach, Austria; JEFF ROBERTS, JENNIE HUANG, JOHN LAM and RAHIM FOROUHI, n&k Technology, San Jose, CA
New approaches can help improve cycle time and achieve higher purity inter-process wafer environmental control. MICHAEL BRAIN, MAY SU, ANTHONY BONORA, and DANIEL BABBS, Brooks Automation, Chelmsford, MA
The process flows applied today for real product manufacturing are quite different from the process flows initially proposed for a universal 3D IC. THORSTEN MATTHIAS and PAUL LINDNER, EV Group, St. Florian, Austria
TechXPOT speakers highlight the challenges ahead on the road to 14nm. Debra Vogler, SEMI, San Jose, CA
At press time, inflection points have been top of mind, as we get ready for The ConFab. I've been reviewing all the presentations and looking forward to a fantastic event.
The International Symposium on Electronic Packaging was held in Osaka the week of April 10th with keynote speakers, Dr. Subramanian S. Iyer of IBM, Dr. Takeshi Uenoyama of Panasonic, and Dr. Urmi Ray of Qualcomm.
After a functional A-sample prototype is built, it doesn't take long for a project to gain traction that has market pull.
Random process variations and layout-dependent effects are a fact of life for designers working at the more advanced process nodes and become critical at 45nm. Besides random and systematic variation effects, reliability effects, such as bias-temperature-instability (BTI), also become prevalent, introducing another dimension of variations that impact parametric yield.
The Advanced Technology Investment Company (ATIC) and the Semiconductor Research Corporation (SRC) last month launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.
At the 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES unveiled a comprehensive set of certified design flows to support its most advanced manufacturing processes.
For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year, according to a MEMS Competitive Analysis Report from information and analytics provider IHS.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion), according to the May edition of the SEMI World Fab Forecast.
This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment.
May 22, 2014Sponsored by Diamond-MT
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014Sponsored by Master Bond, Inc.,
August 14th at 1:00 p.m. ET Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.
July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.
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