Table of Contents

Solid State Technology

Year 2013
Issue 6



Mobility now driving the industry

It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.


Quarterly semiconductor sales increase 6%, outperforming industry forecast

The Semiconductor Industry Association (SIA) announced that worldwide sales of semiconductors reached $74.65 billion during the second quarter of 2013, an increase of 6 percent from the first quarter when sales were $70.45 billion.


Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.


Edwards to be acquired by Atlas Copco

Edwards, a supplier of vacuum products, abatement systems and related value-added services, and Sweden-based Atlas Copco entered into a definitive merger agreement in a transaction valued at up to approximately $1.6 billion, including the assumption of debt.


Crossbar unveils resistive RAM with simple, three-layer structure

Crossbar, Inc., a start-up company, unveiled a new Resistive RAM (RRAM) technology that will be capable of storing up to one terabyte (TB) of data on a single 200mm2 chip.


IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).



Packaging at The ConFab

At The ConFab conference in Las Vegas in June, Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.” In his presentation “The expanding Role of OSATS in the Era of System Integration,” Ma looked at the obstacles to 2.5/3D implementation and came up with the conclusion that cost is still a significant deterrent to all segments.


Megasonic Cleaning without Damage?

Megasonics has been used considered and used for many years to meet many of the cleaning challenges, but it has been shown to cause damage to nanoscale device structures such as polysilicon lines.

3D Integration

Inside the Hybrid Memory Cube

The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.


Package level integration: challenges and opportunities

A wide array of package level integration technologies now available to chip and system designers are reviewed.


High temperature reverse bias reliability testing of high power devices

Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.


Logic gates in graphene technology

Serial production of a QCA graphene cell could be possible. Simple, well-defined process steps are identified.


Thermal considerations in LED modules

Common thermal considerations in LEDs include test point temperature and thermal power.