Table of Contents

Solid State Technology

Year 2014
Issue 5


3D Integration

Fusion bonding for next-generation 3D-ICs

Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.


Can lean innovation bring growth and profits back to semiconductors?

New approaches to start-ups can unlock mega-trend opportunities.


Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics

Reducing plasma-induced damage is key to advancing the scaling limits.


3D memory for future nanoelectronic systems

Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.


Superfast stress inspection for overlay control

Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Fab Infrastructure

Harnessing big data

Addressing the analytics challenges in supply chain management.


On the road to recovery: Semiconductor growth expected for the next two years

According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

200mm equipment market gaining new lease on life

In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

UC Santa Barbara researchers introduce highest performing III-V metal-oxide semiconductor FET

Researchers from the University of California, Santa Barbara (UCSB) will introduce today the highest performing III-V metal-oxide semiconductor (MOS) field-effect transistors (FETs) at the 2014 Symposium on VLSI Technology.

IEEE Packaging Awards handed out at 2014 ECTC

The 2014 Electronic Component Technology Conference (ECTC) took place last week in Orlando Florida.



Three fundamental shifts

At The ConFab last week, Dr. Gary Patton, vice president, semiconductor research and development center at IBM, said there is a bright future in microelectronics (I heartily agree).


At The ConFab 2014: Do we still need Moore’s Law?

Many questions were in the air on the first day of the 10th annual ConFab 2014, and certainly chief among them was raised during Dr. Roawen Chen of Qualcomm\\\\\\\\\\\\\\\'s keynote \\\\\\\\\\\\\\\"What\\\\\\\\\\\\\\\'s On Our Mind\\\\\\\\\\\\\\\" on Monday morning when he asked, “Should we pursue Moore\\\\\\\\\\\\\\\'s Law unconditionally?\\\\\\\\\\\\\\\"


2014 iTherm

iTherm is the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. The 2014 iTherm was held concurrently with the ECTC in Orlando, FL. This year’s General Chair was Mehdi Basheghi of Stanford and program chair was Madhusudan of Google. Attendance this year was up 50% to ~ 400.

Industry Forum

A call to provide advanced equipment to growth companies

Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.