Issue



Table of Contents

Solid State Technology

Year 2014
Issue 6

FEATURES

Lithography


Lithography: What are the alternatives to EUV?

Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.


Lithography


Gas applications in lithography

Lithography is a key enabling process with very demanding requirements. Shrinking feature sizes will raise the bar even further.


Design


10nm success depends on concurrent design and development

The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.


EDA


Rigorously tuned compact models: Extending predictive models to full-chip

Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.


Image Sensors


Global shutter image sensors

Different GS pixel architectures and technologies are presented and performances compared.


Process Control


A fundamental truth of process control

You can’t fix what you can’t find. You can’t control what you can’t measure.


Big Data


The semiconductor industry: Out in front, but lagging behind

Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.


NEWS


Strong growth in second quarter 2014 silicon wafer shipments

Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.



Global semiconductor industry on pace for record sales through first half of 2014

Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.



SEMATECH and CNSE/SUNY launch new patterning center

SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence.



Solid State Technology and SEMI announce the 2014 “Best of West” Award winner

Solid State Technology and SEMI, yesterday announced the recipient of the 2014 “Best of West” Award -- Nikon Corporation -- for its NSR-S630D Immersion Scanner. The award recognizes important product and technology developments in the microelectronics supply chain. The Best of West finalists were selected based on their financial impact on the industry, engineering or scientific achievement, and/or societal impact.


COLUMNS

Editorial


Beautiful, brilliant people

It would be difficult to overstate how critical the development of a workable, high volume manufacturing EUV lithography solution is to the semiconductor industry.


Packaging


Controlling warpage in advanced packaging

As we continue to miniaturize, warpage remains the main problem encountered in all areas of advanced packaging.


Semiconductors


The significance of IBM's EUV benchmark

IBM’s NXE3300B scanner, at the EUV Center of Excellence in Albany, recently completed a “40W” EUV light source upgrade.


Industry Forum


SEMI advocates for the industry in Washington

With changes coming in Washington, SEMI has important work ahead supporting the innovators and job creators of this country.