Issue



Table of Contents

Solid State Technology

Year 2014
Issue 8

FEATURES

Annealing


Laser spike annealing resolves sub-20nm logic device manufacturing challenges

LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.


Metrology


From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.


LED Manufacturing


LED manufacturing with NMP-free resist stripping

The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry.


Process Watch


The most expensive defect

Defects that aren’t detected inline cost fabs the most.


ESD


Eliminating electrostatic discharge: Protecting tomorrow's technology

A new range of dissipative materials based on fluoroelastomer and perfluoroelastomer polymers is designed for wafer processing and wafer handling applications.


Liquid Precursors


Delivering new liquid metalorganic precursors to epi and CVD

The case is made for delivering liquid precursors from a central delivery system to the epi/dep tool as a vapor of precisely-controlled composition.


NEWS


IBM to pay GlobalFoundries $1.5B to take over chip fabs

IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM\'s global commercial semiconductor technology business.



Wearable sensor market to expand sevenfold in five years

Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019


COLUMNS

Editorial


The ConFab 2015: Time for collaboration

The future of the semiconductor industry continues to shine brightly.


Semiconductors


A new hardmask process, Saphira

A new hardmask material and process was introduced this month by Applied Materials. Designed for advanced logic and memories, including DRAM and vertical NAND, the hardmask is transparent, which simplifies processing.


Packaging


A little more patience required for 2.5/3D

There is an old proverb that states “All things Come to Those Who Wait.” I personally am not the waiting type wanting to get things done ASAP but most civilizations look at patience as a virtue.


Industry Forum


IoT's divergent needs will drive different types of technologies

Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges - both economic and technical.