Table of Contents

Solid State Technology

Year 2015
Issue 2



Supplier Hub answers the needs of a changing semiconductor industry

Supplier Hub answers the needs of a changing semiconductor industry.


Advanced analytics for yield improvement and zero defect in semiconductors

Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates.


Imaging tomorrow’s components, acoustically

Packages are changing. Acoustic methods provide a way to image and analyze them.


Consider packaging requirements at the beginning, not the end, of the design cycle

Consider these eight issues where the packaging team should be closely involved with the circuit design team.

Test And Measurement

Techniques for simplifying pulsed measurements: Part 2

Common pulsed measurement challenges are defined.

Flexible Displays

Web tension control in roll-to-roll web processing

Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity.


Global semiconductor industry posts record sales in 2014

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the global semiconductor industry posted record sales totaling $335.8 billion in 2014, an increase of 9.9 percent from the 2013 total of $305.6 billion.

Smartphone display manufacturers facing pressure to further reduce prices in 2015

Even as smartphone panel resolution continues to rise, and as display sizes continue to grow, panel manufacturers are facing pressure to reduce prices.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.


Industry Forum

Flexible facilities for 450mm wafer fabs

When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.