Table of Contents

Solid State Technology

Year 2015
Issue 5


Silicon On Insulator

Substrate innovation for extending Moore and more than Moore

Engineered SOI substrates are now a mainstream option for the semiconductor industry.


Controlling measurements of WLP on high mix, high volume manufacturing

The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).


Is it time to switch to OASIS.MASK?

A summary of OASIS standard advantages and weaknesses is presented, based on six years of experience with customer databases.


More change for the chip industry

As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.


ECAE improves sputtering target performance

Because it can achieve extreme deformation, Equal Channel Angular Extrusion (ECAE) can deliver submicron, high strength and uniform microstructures. The resulting improvements in strength allow for monolithic targets with a longer target life of 20-100%.


NXP Semiconductors announces agreement to sell RF power business

NXP Semiconductors N.V. today announced an agreement that will facilitate the sale of its RF Power business to Jianguang Asset Management Co. Ltd.

“Easy does it” ─ Fabs trim spending plans

Still capex and equipment spending expected to increase in 2015 and 2016.

Avago Technologies acquisition of Broadcom creates new semiconductor powerhouse

Merger activity in the semiconductor industry moved to a new level with the announcement of the agreement for Avago Technologies to acquire Broadcom.

MEMS suppliers ride automotive safety wave

Suppliers of MEMS-based devices rode a safety sensing wave in 2014 to reach record turnover in automotive applications, according to analysis from IHS.



Blood and tears at DAC

At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes � and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.