Issue



Table of Contents

Solid State Technology

Year 2017
Issue 3

FEATURES

Silicon On Insulator


FD-SOI: How a pioneering technology entered mainstream markets

With its unique characteristics, FD-SOI is generating increasingly strong interest from major players in the semiconductor ecosystem for a very wide range of markets.


Lithography


First EUV lithography high-volume manufacturing solution for N5 BEOL

Immersion-based self-aligned quadruple patterning is combined with EUV lithography block patterning to achieve metal layers with pitches as small as 32nm.


Materials


Discovery of new PVD chalcogenide materials for memory applications

A case study is presented based on the use of high throughput experimentation (HTE) for the discovery of new memory materials.


NEWS


IC Insights more than doubles its 2017 IC market growth forecast

Huge spike in DRAM and NAND flash ASPs prompts market forecast revision to 11% increase.



Record spending for fab equipment expected in 2017 and 2018

Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record ? more than US$46 billion in 2017.



Micron to establish its site for DRAM in Taiwan

Micron has now completed the title acquisition process for the new site.



EUV lithography progress emphasized at SPIE Advanced Lithography

New extreme-ultraviolet (EUV) lithography equipment unveiled by ASML, announcement by Intel of eight EUV programs ready to be rolled out, and introduction by IMEC of the industry’s first comprehensive solution for EUVL-enabled high-volume manufacturing systems were among highlights at SPIE Advanced Lithography 2017 in San Jose earlier this month.


COLUMNS

Editorial


The ConFab preview

The agenda is set for The ConFab, to be held May 14-17, 2017 in San Diego at the iconic Hotel del Coronado.


Packaging


New business models emerging

Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.


Semiconductors


Silicon photonics advances

With rapidly increasing use of “cloud” client:server computing there is motivation to find cost-savings in the cloud hardware, which leads to R&D of improved photonics chips.


Industry Forum


MRAM lowers system power

ST-MRAM (spin-transfer magnetic RAM) is an extremely promising new technology with the potential to replace major segments of the market for flash, SRAM, and DRAM semiconductors in applications such as mobile products, automotive, IoT, and data storage.