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Solid State Technology
Silicon On Insulator
FD-SOI: How a pioneering technology entered mainstream markets
With its unique characteristics, FD-SOI is generating increasingly strong interest from major players in the semiconductor ecosystem for a very wide range of markets.
First EUV lithography high-volume manufacturing solution for N5 BEOL
Immersion-based self-aligned quadruple patterning is combined with EUV lithography block patterning to achieve metal layers with pitches as small as 32nm.
Discovery of new PVD chalcogenide materials for memory applications
A case study is presented based on the use of high throughput experimentation (HTE) for the discovery of new memory materials.
IC Insights more than doubles its 2017 IC market growth forecast
Huge spike in DRAM and NAND flash ASPs prompts market forecast revision to 11% increase.
Record spending for fab equipment expected in 2017 and 2018
Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record ? more than US$46 billion in 2017.
Micron to establish its site for DRAM in Taiwan
Micron has now completed the title acquisition process for the new site.
EUV lithography progress emphasized at SPIE Advanced Lithography
New extreme-ultraviolet (EUV) lithography equipment unveiled by ASML, announcement by Intel of eight EUV programs ready to be rolled out, and introduction by IMEC of the industry’s first comprehensive solution for EUVL-enabled high-volume manufacturing systems were among highlights at SPIE Advanced Lithography 2017 in San Jose earlier this month.
The ConFab preview
The agenda is set for The ConFab, to be held May 14-17, 2017 in San Diego at the iconic Hotel del Coronado.
New business models emerging
Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.
Silicon photonics advances
With rapidly increasing use of “cloud” client:server computing there is motivation to find cost-savings in the cloud hardware, which leads to R&D of improved photonics chips.
MRAM lowers system power
ST-MRAM (spin-transfer magnetic RAM) is an extremely promising new technology with the potential to replace major segments of the market for flash, SRAM, and DRAM semiconductors in applications such as mobile products, automotive, IoT, and data storage.