Issue

FEATURES

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Laser Marking

The basics of laser marking are reviewed, as well as current and emerging laser technologies.

Lithography

DSA and EUV should be envisioned as complementary, not competing, techniques that will eventually become mainstream for fine-pitch lithography.

Emerging Devices

Applications now include nanoscale Spintronics sensors that further enhance the areal density of hard disk drives, through MRAMs that are seriously being considered to replace embedded flash, static random access memories (SRAM) and at a later stage dynamic random access memories (DRAM).

Metrology

A new system combines acoustic, optical and reflectometric techniques to enable measurement of metals, dielectrics, resists and critical dimensions on a single platform.

Solar

Last year was a great year for photovoltaic (PV) technology.

Components

Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.

NEWS

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TECHCET\'s model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter.

The III-N semiconductor family has attracted significant research attention over the last 25 years, resulting in intensive patenting activity, with a substantial increase during the past decade.

Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

Electrical engineers at Stanford have identified two semiconductors that share or even exceed some of silicon’s desirable traits, starting with the fact that all three materials can \"rust.\"

COLUMNS

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Editorial

In 2018, 7.7 percent growth is expected, resulting in another record-breaking year -- totaling $53.2 billion for the global semiconductor equipment market.

Packaging

It has been nearly a decade since Toshiba announced the use of backside TSV\'s to miniaturize CMOS image sensors.

Semiconductors

In the advanced CMOS technology programs ongoing in the Belgium city of Leuven, imec works to extend the building-blocks of integrated circuits (IC).

Industry Forum

The ConFab 2018, to be held May 20-23 in Las Vegas at THE COSMOPOLITAN of Las Vegas, will take a close look at the new applications driving the semiconductor industry, the technology that will be required at the device and process level to meet new demands, and -- perhaps most importantly -- the kind of strategic collaboration that will be required.