Issue



Table of Contents

Solid State Technology

Year 2017
Issue 9

FEATURES

Inspection


Reveal previously invisible defects and contaminants in advanced packaging applications

A new illumination technology compares favorably to conventional bright field illumination.


Advanced Packaging


Solutions for controlling resin bleed out

The hows and whys of resin bleed-out (RBO) are discussed, as well as the impact it makes and how to control it.


Metrology


3D acoustic images expand their usefulness

3D acoustic imaging is useful for measuring the heights of bumps on BGAs, flip chips, and other devices. But it can also be used to image and quantify depth/height variation of features within a particular sample.


Wet Processing


Surface preparation technology provides pristine and stable hydrogen passivated semiconductor surfaces

A new technology enables dramatically lower thermal budget capability that is enabling to thermal processes like epitaxy, CVD and diffusion, without any semiconductor material consumption.


NEWS


Deep-depletion: A new concept for MOSFETs

An international team of researchers has created a proof of concept that uses the deep-depletion regime in bulk-boron-doped diamond MOSFETs to increase hole channel carrier mobility.



A*STAR IME's new multi-chip FOWLP development line to drive innovation and growth in semiconductor industry

A*STAR’s Institute of Microelectronics (IME) has established a development line to accelerate the development of fan-out wafer level packaging (FOWLP) capabilities for next-generation Internet of Things (IoT) technologies.



China IC industry outlook

With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.



Broadcom proposes to acquire Qualcomm

The Broadcom proposal stands whether Qualcomm\'s pending acquisition of NXP Semiconductors N.V. is consummated on the currently disclosed terms of $110 per NXP share or the transaction is terminated.


COLUMNS

Editorial


The ConFab 2018 update

A new wave of growth is sweeping through the semiconductor industry, propelled by a vast array of new applications, including artificial intelligence, virtual and augmented reality, automotive, 5G, the IoT, cloud computing, healthcare and many others. The big question facing today’s semiconductor manufacturers and their suppliers is how can they best position themselves to take advantage of this tremendous growth.


Semiconductors


IBM's Khare on A.I.

Mukesh Khare, VP of IBM Research, talked about the impact artificial intelligence (AI) is going to have on the semiconductor industry during a recent panel session hosted by Applied Materials. He said that today most artificial intelligence is too complex.


Industry Forum


Smart management in the sub-fab improves safety, reliability, cost and yield

With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates.