Table of Contents

Solid State Technology

Year 2018
Issue 1



High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

3D integration and packaging has challenged failure analysis (FA) techniques and workflows due to the high complexity of multichip architectures, the large variety of materials, and small form factors in highly miniaturized devices.


2018: Big changes in mask manufacturing and what it means for mask models

There are big changes on the horizon for semiconductor mask manufacturing, including the imminent first production use of multi-beam mask writers, and the preparation of all phases of semiconductor manufacturing for the introduction of extreme ultra-violet (EUV) lithography within the next few years.


Understanding ALD, MLD and SAMs as they enter the fab

As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.


Executive viewpoints: 2018 outlook

Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.


Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position

Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to preliminary results by Gartner, Inc. Undersupply helped drive 64 percent revenue growth in the memory market, which accounted for 31 percent of total semiconductor revenue in 2017.

Nanostructured gate dielectric boosts stability of organic thin-film transistors

A nanostructured gate dielectric may have addressed the most significant obstacle to expanding the use of organic semiconductors for thin-film transistors.

Industry enters the age of WOW

The semiconductor industry has been there before, with large increases in investments followed by dramatic downturns. While the most dramatic downturns, 2001 and 2009, were due to, in a large part, acro-economic factors, the industry has typically observed one to two years of increased investment spending followed by a down period. This time around, the industry will achieve a “WOW” with three consecutive years of fab investment growth, a pattern not observed since the mid-1990s.


Industry Forum

Work to do to keep the good times rolling

2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.