This work explores the effect of underlying metallic alloys and the influence of Cu loss under via bottom after dry etching and wet cleaning processes. To Improve the Cu loss under via bottom, effective approaches are proposed. The modified actions for via bottom improve not only wafer yield but also reliability of the device.
This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the challenges involved in the automotive supply chain. Future articles in the series will address specific process control solutions to those challenges.