LED Manufacturing

LED MANUFACTURING ARTICLES



TrendForce reports 'micro LED-like' products will be available in 2018

07/21/2017  Breakthroughs in mass transfer have yet to materialize.

ALD tools evolve with industry needs

07/13/2017  Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.

Harnessing hopping hydrogens for high-efficiency OLEDs

07/10/2017  Researchers at Kyushu University's Center for Organic Photonics and Electronics Research (OPERA) demonstrated that a molecule that slightly changes its chemical structure before and after emission can achieve a high efficiency in organic light-emitting diodes (OLEDs).

Pixelligent Technologies awarded $2.15M in grant funding from U.S. Departments of Energy, Defense

07/10/2017  Pixelligent Technologies, a nanocomposite advanced materials manufacturer, announced today that it has been awarded grant funding from the Department of Energy SBIR program and the Department of Defense STTR program, that totals a combined $2.15 million

Umicore inaugurates new production facility in Germany

06/29/2017  Umicore’s business unit Precious Metals Chemistry today inaugurated its production unit for advanced metal organic precursor technologies used in the semiconductor and LED markets.

Pixelligent Technologies named 2017 Manufacturer of the Year by Frost & Sullivan

06/19/2017  It won this award in the small/midsize company category for companies with revenues under $1B, for its PixClearProcess that is revolutionizing chemical composite technology.

Samsung achieves 220 lumens per watt with new mid-power LED package

06/15/2017  Samsung Electronics Co., Ltd. today announced that it has begun mass producing a new mid-power LED package, the LM301B, which features the industry's highest luminous efficacy of 220 lumens per watt.

Osram's next-generation of LEDs set new standards in miniaturization

06/14/2017  Osram Opto Semiconductors today presented the latest generation of surface-mountable LED, the Topled E1608, with a package smaller than its predecessor models by a factor of 20.

Dow Corning CL-1000 optical silicone binder extends thermal and optical performance for chip-scale LED package designs

06/09/2017  Dow Corning today introduced Dow Corning CL-1000 Optical Silicone Binder, a new, more thermally stable, high refractive index (RI) material available only in China that is formulated to expand design options for high-power chip-scale LED packaging (CSP).

2017FLEX Korea: First flexible hybrid electronics conference in Korea

05/10/2017  Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.

SEMICON Southeast Asia 2017: Disruption and the value of digital transformation in manufacturing

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

LG Innotek launches UV LED module for sterilizing water purifier faucets

04/12/2017  LG Innotek succeeded in mass-producing ultraviolet (UV) LED module that sterilizes the inside of water purifier faucet aerators.

Seoul Semiconductor files patent infringement lawsuit in Germany asserting infringement of its high-power LED technology

04/12/2017  On March 31, 2017, Seoul Semiconductor Co., Ltd (Seoul) filed a patent infringement lawsuit in Germany in the District Court of Düsseldorf against Mouser Electronics Inc. (Mouser), a global electronic components distributor, asserting infringement of an LED patent.

LED Taiwan opens tomorrow in Taipei

04/11/2017  With a combined 500 booths, the exhibitions and conferences of LED Taiwan, opening tomorrow in Taipei, will attract over 12,000 visitors.

Optoelectronics, sensors/actuators, and discretes move toward normal growth rates

04/05/2017  Weakness in high-brightness LEDs lowered optoelectronics in 2016 while sensors/actuators got a needed boost from improved pricing.

Cree launches the industry’s brightest and most efficient royal blue LED

03/31/2017  Cree, Inc. announces the new XLamp XP-G3 Royal Blue LED, the industry’s highest performing Royal Blue LED.

Ultratech receives follow-on multiple orders from China foundries for laser spike annealing systems

03/24/2017  Ultratech, Inc. this week announced that two China foundries placed follow-on orders for laser spike anneal systems.

The repulsion trick: A self-solving puzzle for organic molecules

03/16/2017  Jülich researchers have succeeded in controlling the growth of organic molecules using a special trick.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Group blazes path to efficient, eco-friendly deep-ultraviolet LED

03/03/2017  A Cornell-led group has demonstrated the ability to produce deep-ultraviolet emission using an LED light source, potentially solving several problems related to quantum efficiency of current devices.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS