LED Manufacturing

LED MANUFACTURING ARTICLES



TEL NEXX modernizes shop floor data collection and quality control with InfinityQS ProFicient

11/16/2017  Quality Intelligence solution enables chip metallization provider to improve accuracy and timeliness of data capture, rapidly respond to issues, and identify opportunities for continuous improvement.

The stacked color sensor

11/16/2017  True colors meet minimization.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

The next generation of power electronics? Gallium nitride doped with beryllium

11/10/2017  How to cut down energy loss in power electronics? The right kind of doping.

Tech increases microfluidic research data output 100-fold

11/09/2017  Researchers have developed a technique that allows users to collect 100 times more spectrographic information per day from microfluidic devices, as compared to the previous industry standard. The novel technology has already led to a new discovery: the speed of mixing ingredients for quantum dots used in LEDs changes the color of light they emit - even when all other variables are identical.

Pixelligent Technologies appoints Alain Harrus and Gene Banucci to its Board of Directors

11/07/2017  Pixelligent Technologies announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

MagnaChip offers 0.35 micron 700V ultra-high voltage process technology with process simplification

11/06/2017  MagnaChip Semiconductor Corporation announced today it now offers a 0.35 micron 700V Ultra-High Voltage process technology (UHV) that reduces mask counts, manufacturing time and cost for power-related AC-DC products.

Veeco and ALLOS demonstrate 200mm GaN-on-Si performance to enable micro-LED adoption

11/01/2017  Veeco Instruments Inc. (Nasdaq: VECO) announced today the completion of a strategic initiative with ALLOS Semiconductors (ALLOS) to demonstrate 200mm GaN-on-Si wafers for Blue/Green micro-LED production.

Optoelectronics, sensors/actuators and discretes climb

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

Power GaN: Everything is in place for volume production

10/25/2017  Yole projects the explosion of the market with 84% CAGR between 2017 and 2022. The market value will so reach US$ 450 million at the end of the period.

Seoul Semiconductor's Horticultural Series LEDs deliver entire spectrum from UV-C to far-red

10/24/2017  The newly-introduced Horticultural Series LEDs from Seoul Semiconductor represent the only LED manufacturer to provide the entire spectrum of solid state lighting sources for the efficient growth and propagation of plants.

Researchers bring optical communication onto silicon chips

10/23/2017  Ultrathin films of a semiconductor that emits and detects light can be stacked on top of silicon wafers.

NRL clarifies valley polarization for electronic and optoelectronic technologies

10/20/2017  Many of today's technologies, such as, solid-state lighting, transistors in computer chips, and batteries in cell phones rely simply on the charge of the electron and how it moves through the material. In certain materials, such as the monolayer transition metal dichalcogenides (TMDs), electrons can be selectively placed into a chosen electronic valley using optical excitation.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

SEMICON Europa 2017: Keynotes announced

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

SSL technologies enable the development of new functionalities in automotive lighting

10/09/2017  The automotive lighting market totaled US$25.7 billion in 2016 and is expected to reach US$35.9 billion in 2022, with a 5.7% CAGR between 2016 and 2022.

WIN Semiconductors enhances 0.25µm GaN power process

10/09/2017  The NP25 technology provides 28-volt operation with superior power density and efficiency for demanding power applications through Ku-band.

Solar-Tectic LLC receives patent for III-V thin-film tandem high-performance solar cell and LED technology

09/28/2017  The patent, the first ever for a thin III-V layer on crystalline silicon thin-film, covers group III-V elements such as Gallium Arsenide (GaAs), and Indium Gallium Phosphide (InGaP), for the top layer, as well as all inorganic materials, including, silicon, germanium, etc., for the bottom layer.

With more than $4B revenue, the LED lighting module market is showing attractive perspectives

09/28/2017  The LED lighting module industry is showing the emergence of innovative functions and the introduction of new market segments including automotive, smart lighting and horticultural markets.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

VIDEOS