LED Manufacturing

LED MANUFACTURING ARTICLES



Quantum Materials acquires Bayer Technology Services quantum dot patents

08/20/2014  Quantum Materials Corporation today announced the purchase of five diverse sets of patent families from Bayer Technology Services GmbH, the global technological backbone and major innovation driver for Bayer AG of Leverkusen, Germany.

Ushio to expand solid-state light source business with Oclaro Japan acquisition

08/15/2014  The closing of the transaction is expected to occur during the fourth calendar quarter of 2014.

LightFair International 2015 call for speakers opens

08/15/2014  The LIGHTFAIR International (LFI) 2015 Call for Speakers opens in a global invitation seeking responses from top lighting and design practitioners looking to participate in the world's largest annual architectural and commercial lighting trade show and conference in New York May 3-7, 2015.

Seoul Semiconductor moves in to the Top 5 global LED manufacturers

08/08/2014  This is a step up from the 2012 ranking of number five global LED manufacturer despite any internal captive revenue.

Apple saved the sapphire industry in 2013 and could transform it in 2014

08/05/2014  In 2013, Apple completely saved the sapphire industry. This year, in 2014, Apple could transform this industry. Will the revolution happen?

Cambridge Nanotherm appoints Ralph Weir as CEO

07/31/2014  Cambridge Nanotherm, a producer of semiconductor heatsink technology, today announced that it has appointed semiconductor industry veteran Ralph Weir as its CEO.

TriQuint becomes first manufacturer to achieve MRL 9 for GaN

07/30/2014  TriQuint Semiconductor, Inc., a RF solutions supplier and technology innovator, announced that it is the first gallium nitride (GaN) RF chip manufacturer to achieve Manufacturing Readiness Level (MRL) 9.

First Chinese supplier breaks into Top 10 LED rankings in 2013

07/16/2014  China’s massive investments in light-emitting diode (LED) manufacturing capacity are paying off, with a Chinese company entering the top ranks of the global market for the first time ever

Lighting accounted for one-quarter of all LED driver IC revenue in 2013

07/16/2014  One out of every four dollars spent worldwide on light-emitting diode (LED) drivers in 2013 was used for lighting applications, illustrating the growing importance of illumination in the LED business.

Crystal IS introduces Optan LED technology

06/12/2014  Crystal IS, a developer of high-performance ultraviolet (UVC) LEDs, this week announced availability of Optan.

Dow Corning silicone wins Innovation Award at 2014 LIGHTFAIR International

06/05/2014  This marks the third time in two years that Dow Corning’s Moldable Silicone product technology has garnered top recognition during LIGHTFAIR International’s (LFI) annual awards.

Crystal IS primes for transition to commercial manufacturing

05/20/2014  Crystal IS, a developer of the most effective UVC LEDs, today announced the appointment of John Gartner as its first vice president of operations.

Cree announces low cost extended bandwidth GaN HEMT transistors

05/07/2014  In response to broader bandwidth demand, Cree, Inc. introduces a family of GaN HEMT RF transistors that delivers industry-leading bandwidth and high efficiency performance to support today’s busy LTE networks.

Veeco appoints Shubham Maheshwari as chief financial officer

05/06/2014  Mr. Maheshwari replaces David D. Glass, who announced his retirement from Veeco last December.

More GaN-on-Si players on the playground, business is starting

04/24/2014  GaN-on-Si is entering in production. Under this context, what is the patent situation?

Epistar extends collaboration with Intermolecular

04/24/2014  Intermolecular, Inc. today announced that Epistar Corp. and Intermolecular have signed a multi-year extension of their existing collaborative development program (CDP) and royalty-bearing IP licensing agreement to increase the efficiency and reduce the cost of Epistar's light emitting diode (LED) devices.

Dow Corning moves to defend Chinese patent for LED optical silicone encapsulants

04/17/2014  Dow Corning filed a complaint through its Chinese subsidiary and licensee with the Shanghai First Intermediate Court.

To bridge LEDs' green gap, scientists think small

04/04/2014  Nanostructures half the breadth of a DNA strand could improve the efficiency of light emitting diodes (LEDs), especially in the "green gap," a portion of the spectrum where LED efficiency plunges, simulations at the U.S. Department of Energy's National Energy Research Scientific Computing Center (NERSC) have shown.

Leti to demonstrate wireless high data rate Li-Fi prototype

03/27/2014  CEA-Leti will demonstrate its new prototype for wireless high data rate Li-Fi (light fidelity) transmission at Light + Building 2014 in Frankfurt, Germany, March 30-April 4. The technology employs the high-frequency modulation capabilities of light-emitting diode (LED) engines used in commercial lighting.

New technique makes LEDs brighter, more resilient

03/21/2014  Researchers from North Carolina State University have developed a new processing technique that makes light emitting diodes (LEDs) brighter and more resilient by coating the semiconductor material gallium nitride (GaN) with a layer of phosphorus-derived acid.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology

August 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014