LED Manufacturing

LED MANUFACTURING ARTICLES



Soraa supports TM-30 as a superior color test for the lighting industry

03/14/2016  Soraa, a developer of GaN on GaN LED technology, today announces its support for advances in color science and the new TM-30 method released by the Illuminating Engineering Society (IES).

Many Mixes to Match Litho Apps

03/03/2016  "Mix and Match" has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing.

Lifetime breakthrough promising for low-cost and efficient OLED displays and lights

03/01/2016  Researchers increased the device lifetime of OLEDs that use a recently developed class of molecules to convert electricity into light.

Artificial control of exciplexes opens possibilities for new electronics

02/26/2016  Researchers at Kyushu University were able to widely vary the emission color and efficiency of OLEDs.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

Physicists promise a copper revolution in nanophotonics

02/25/2016  Researchers from the Moscow Institute of Physics and Technology (MIPT) have for the first time experimentally demonstrated that copper nanophotonic components can operate successfully in photonic devices.

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

Veeco launches new K475i As/P MOCVD system

02/18/2016  Veeco Instruments Inc. announced today the launch of the new TurboDisc K475i Arsenic Phosphide MOCVD System for the production of red, orange, yellow light emitting diodes.

LED Taiwan 2016 to kick off in Taipei in April

02/17/2016  LED Taiwan will be held at TWTC Nangang Exhibition Hall in Taipei on April 13-16.

Veeco announces collaboration with imec to drive performance gains in GaN-based power devices

02/16/2016  The collaboration is expected to accelerate the development of highly-efficient, Gallium Nitride (GaN) based, power electronic devices using GaN Epi wafers created using Veeco's Propel Power GaN MOCVD system.

Ultratech announces promotion of two executives

02/10/2016  Ultratech, Inc., a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high­brightness LEDs (HB­ LEDs), as well as atomic layer deposition (ALD) systems, announced the promotion of two of its executives.

Top LED company selects ClassOne's Solstice electroplater

02/09/2016  Semiconductor equipment manufacturer ClassOne Technology announced the purchase of its Solstice S8 electroplating system by one of the world's leading LED manufacturers.

Quantum dot market worth $4.6B by 2021

01/29/2016  The global value of quantum dot markets was $306 million USD in 2014 and is expected at $4.6 billion USD over the forecast period due to the subsequent generation device, display, and system activated by quantum dot.

SEMICON Korea opening: Memory and mobility drive IC manufacturing

01/26/2016  SEMICON Korea 2016 at COEX in Seoul opens tomorrow with more than 540 exhibiting companies and an expected 40,000 attendees.

Memristor Variants and Models from Knowm

01/22/2016  Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

Cornell-led team creates gallium nitride power diode

01/22/2016  Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.




TWITTER


WEBCASTS



Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS