LED Manufacturing


Dow Corning newest moldable optical silicone expands options for more reliable LEDs

11/19/2013  Dow Corning introduced new Dow Corning MS-2002 Moldable White Reflector Silicone here at Strategies in Light Europe 2013.

Seoul Semiconductor introduces next generation of high power LEDs

11/18/2013  The improved efficacy helps lighting manufacturers use fewer LEDs in their system designs which translate to lower system costs.

SemiLEDs introduces 10W integrated RGBW LED

11/18/2013  SemiLEDs Corporation today announced the introduction and release of the 10-Watt M63 RGBW integrated 6363 LED.

Blog Review November 18 2013

11/18/2013  New blogs cover the possibility of GLOBALFOUNDRIES producing Apple’s A7 chip in New York, silicon photonics and optical interconnects, a new Pattern Aware Memory IP technology from Memoir Systems, and several advancements in 3D integration related to RDL interconnects, thin wafer handling and a new low temp via reveal passivation process with stress compensation.

The US lighting control systems industry: A market in transition

11/14/2013  The lighting control systems marketplace has been in a state of transition in recent years. Changing energy efficiency codes, new construction project increases, wireless technology benefits, increases in LED lighting adoption and conservation initiatives have been the key factors driving the growth of the lighting control systems market in the US.

Design for Yield Trends

11/12/2013  Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

Research News: Nov. 12, 2013

11/12/2013  Synaptic transistor learns while it computes; Diamond imperfections pave the way to technology gold; The next big thing in the energy sector: Photovoltaic generated DC energy

Blog Review November 11, 2013

11/11/2013  New blogs delve into the impact of pervasive computing on the semiconductor industry, the opportunities in MEMS, flipchip market research, bump-on-polymer reliability, chip embedding, lifetime concerns of EUV optics, a curious take on Moore’s Law and SST’s new editorial calendar for 2014.

Experts At The Table: Design For Yield (DFY) moves closer to the foundry/manufacturing side

11/08/2013  SemiMD discussed the trend for design for yield (DFY) moving closer to the foundry/manufacturing side with Dr Bruce McGaughy, Chief Technology Officer and Senior Vice President of Engineering, ProPlus Design Solutions, Ya-Chieh Lai, Engineering Director, Silicon and Signoff Verification, Cadence and Michael Buehler, Senior Marketing Director, Calibre Design Solutions, Mentor Graphics, and Amiad Conley, Technical Marketing Manager, Process Diagnostics and Control, Applied Materials. What follows are excerpts of that conversation.

Packaging Materials Trends — Mobility is the Key Market Driver

11/07/2013  The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.

QEOS announces advanced LED lighting system

11/04/2013  Quantum Electro Opto Systems Sdn. Bhd. (QEOS), a leading innovator in LED technology, announced today that it is entering the LED lighting and LED lighting systems business

Rubicon launches first commercial line of large diameter patterned sapphire substrates

11/01/2013  Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.

The Week in Review: Nov. 1, 2013

11/01/2013  Toshiba's new embedded NAND; Mentor Graphics releases supply chain tool, SIA execs urge Chinese support of ITA; Graphene research; Cadence releases SoC design solution, GlobalFoundries and Peregrine to collaborate; SEMI announces support of bipartisan manufacturing bill

LED applications to be key drivers for bulk GaN market

10/31/2013  In either a cautious or a more aggressive scenario, LED applications will certainly be the key drivers for the bulk GaN market, according to Yole Développement.

Via Doubling to Improve Yield

10/24/2013  In nanometer designs, the number of single vias, and the number of via transitions with minimal overlap, can contribute significantly to yield loss. Yet doubling every via leads to other yield-related problems and has a huge impact on design size. While there is still concern over of how many vias can be fixed without rerouting and without creating DRC violations, the Calibre via doubling tool can identify via transitions and recommend areas for second via insertion without increasing area.

Research Bits: Oct. 22, 2013

10/22/2013  Size matters in the giant magnetoresistance effect in semiconductors; Thin film semiconductors that will drive production of next-generation displays; Ultraviolet light to the extreme

Blog Review October 21 2013

10/21/2013  EUV on time for 10nm, mask defectivity an issue, pellicles an option, source power timing; DSA very promising; Intel delays 14nm production; FinFETS tech of choice; Intel stands firm on 450mm; Market reports from Semicon Taiwan.

Applied Materials rolls out new CVD and PVD systems for IGZO-based displays

10/17/2013  Applied Materials introduced three new tools for the display market aimed at metal oxide thin film transistors.

Wagon-wheel pasta shape for better LEDs

10/09/2013  "Rotelle" molecules depolarize light, more efficient than "spaghetti"

Marrying diversification, innovation with high-volume manufacturing – the MEMS puzzle

10/08/2013  The explosive growth of the iPhone motion sensing smart phone market has pushed the MEMS industry into high-volume demand. Can they meet demand?



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers


Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts



The ConFab
Las Vegas, Nevada
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
September 16, 2014 - September 17, 2014