07/19/2016 The gallium nitride (GaN) substrates market is set to cross $4 billion USD by 2020, according to the market research report from IndustryARC.
07/15/2016 A collaboration of researchers from Kumamoto, Yamaguchi, and Osaka Universities in Japan have discovered a new method of drastically changing the color and fluorescence of a particular compound using only oxygen (O2) and hydrogen (H2) gases.
07/13/2016 Kateeva is out to change the way displays are being made, and during Tuesday’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.
07/13/2016 Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.
07/12/2016 The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.
06/27/2016 Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.
06/22/2016 Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.
06/21/2016 Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.
06/16/2016 This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.
06/15/2016 WPG Americas Inc. announced today it has signed a new agreement with Seoul Semiconductor the world's fifth largest LED supplier to distribute their full complete line of products.
06/14/2016 Study addresses instability issues with organometal-halide perovskites, a promising class of materials for solar cells, LEDs, and other applications.
06/10/2016 Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction in 2016 and 2017; Tiny lasers enable faster, less power-hungry next-gen microprocessors; IC Insights releases update to Market Drivers Report
06/10/2016 Almost two years after GTAT’s bankruptcy, the sapphire industry is still there. Its decor and characters have, of course, changed but the story is still unfolding.
06/10/2016 While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.
06/06/2016 The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment
06/05/2016 Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.
06/05/2016 Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps
06/03/2016 GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive products; UT Dallas physicists research topological insulators
05/31/2016 SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find new method for doping single crystals of diamond
05/27/2016 Finding paves the way for devices that switch quickly between transparency and opacity to specific forms of light.
November 15, 2016 at 1:00 p.m. ET / Sponsored by Brewer Science
Directed self-assembly (DSA) patterning is one of the primary methods being pursued for future advanced patterning nodes. Since DSA’s initial introduction in the early 2000s, great progress has been made. However, many challenges remain for achieving manufacturing readiness. Key improvements in the areas of materials, defectivity, and process integration are still needed. This webcast will cover published progress to date, review key improvements needed, and discuss new advances in DSA technology. Results from CEA-LETI’s 300-mm lab-to-fab for validation of DSA’s manufacturing readiness will be discussed.
November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics
Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.