LED Manufacturing

LED MANUFACTURING ARTICLES



Next-generation illumination using silicon quantum dot-based white-blue LED

06/09/2015  A hybrid LED is expected to be a next-generation illumination device for producing flexible lighting and display, and this is achieved for the Si QD-based white-blue LED.

Leti demos new process to fabricate high-brightness micro-LED arrays for next-gen head-mounted and head-up displays

06/02/2015  CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings

05/21/2015  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

EV Group NILphotonics Competence Center sees strong demand For emerging photonic applications

05/19/2015  Newly launched center assisting customers in developing products and applications in photonics; leads to multiple system orders.

Cambridge Nanotherm appoints Howard Ford as chairman

05/14/2015  Cambridge Nanotherm today announced that Howard Ford has joined the board as chairman.

New approaches to small problems

05/07/2015  The market expectations of modern electronics technology are changing the landscape in terms of performance and, in particular, power consumption, and new innovations are putting unprecedented demands on semiconductor devices.

Quantum dots are finally ready for prime time

05/05/2015  Quantum dots are finally ready for prime time and will exceed traditional phosphor revenue by 2020 by allowing LCD to compete with OLED in the race for the next display generation.

Defects in atomically thin semiconductor emit single photons

05/05/2015  Researchers at the University of Rochester have shown that defects on an atomically thin semiconductor can produce light-emitting quantum dots.

LED phosphors market: Strong price pressure stalls revenue growth but masks a more complex picture

04/24/2015  While volumes are expected to more than double between 2015 and 2020, LED phosphor prices have declined dramatically, leading to a flat revenue outlook.

San'an licenses Japanese LED patent portfolio to Luminus Devices

04/16/2015  San'an Optoelectronics Co., Ltd. today announced that it has licensed the United States patents of an LED patent portfolio it recently acquired from a major Japanese company to its subsidiary, Luminus Devices, Inc.

Techniques for simplifying pulsed measurements: Part 2

04/08/2015  Common pulsed measurement challenges are defined.

LEDs Taiwan opens today in Taipei

03/25/2015  LED Taiwan, opening today at TWTC Nangang Exhibition Hall in Taipei, is Taiwan's only LED manufacturing-focused exposition.

Seoul Semiconductor introduces new modules based on Acrich3 technology

03/24/2015  Seoul Semiconductor, a developer of LED technology, announced the availability of new Acrich3 modules for a wide range of residential and commercial lighting applications.

Cambridge Nanotherm publishes results of first independent test of thermal management substrates for LEDs

03/19/2015  The tests were conducted by The LIA Laboratories (part of The LIA - Europe’s largest lighting trade association) and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.

The promising future of LEDs

03/19/2015  In 2015, companies are not relying on more technical breakthroughs, except at the LED module level, where integration remains an important issue.

Soraa appoints new Product Development Senior VP

03/17/2015  Soraa, a developer of GaN on GaN LED technology, announced today that Ann Reo has joined the company as Senior Vice President of Product Development.

Recovering economies driving growth in the industrial semiconductor market

03/16/2015  The industrial semiconductor market will post a 9.7 percent compound annual growth rate (CAGR) over the next several years as revenue rises from $34.8 billion in 2013 to $55.2 billion in 2018.

Marktech Optoelectronics adds miniature Point Source LED packages to product lineup

03/11/2015  Marktech Optoelectronics Corp. announces the addition of a PLCC-4 and miniature ceramic package to the 650nm and 850nm Point Source LED series.

New nanowire structure absorbs light efficiently

02/27/2015  Researchers at Aalto University, Finland have developed a new method to implement different types of nanowires side-by-side into a single array on a single substrate.

The future of electronics -- now in 2-D

02/20/2015  The future of electronics could lie in a material from its past, as researchers from The Ohio State University work to turn germanium--the material of 1940s transistors--into a potential replacement for silicon.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015