LED Manufacturing

LED MANUFACTURING ARTICLES



Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

06/06/2016  The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

06/05/2016  Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

06/05/2016  Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps

Solid State Watch: May 27-June 2, 2016

06/03/2016  GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive products; UT Dallas physicists research topological insulators

Solid State Watch: May 20-26, 2016

05/31/2016  SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find new method for doping single crystals of diamond

Engineers discover a new gatekeeper for light

05/27/2016  Finding paves the way for devices that switch quickly between transparency and opacity to specific forms of light.

Solid State Watch: May 13-19, 2016

05/23/2016  IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments; New type of graphene-based transistor will increase the clock speed of processors

Automotive LED industry drivers: Disruptive technologies and consumer behavior changes

05/20/2016  The lighting market for automotive applications should reach a 23.7% compound annual growth rate (CAGR) 2015-2121 reaching a US$27.7 billion market in 2021.

$88M in Series E financing for OLED production equipment maker, Kateeva

05/19/2016  Kateeva today announced that it has closed its Series E funding round with $88 million in new financing.

Ultratech Cambridge Nanotech forms research collaboration with Northeastern University

05/17/2016  Ultratech, Inc. announced the formation of a research collaboration with Professor Thomas J. Webster, Ph.D. at Northeastern University, to study the use of nano-materials produced via ALD for medical applications.

Monolithic Schottky diode in ST F7 LV MOSFET technology: Performance improvement in application

05/11/2016  Standard solutions and devices are compared to a 60 V MOSFET with monolithic Schottky diode as evaluated in SMPS and motor control environments.

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor's SLIM and SWIFT Packaging Technologies

05/05/2016  Amkor Technology, Inc., a outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor's SLIM and SWIFT advanced fan-out package technologies.

How to Boost Verification Productivity with SystemVerilog/UVM and Emulation

05/03/2016  Use of emulation for hardware-assisted testbench acceleration is growing as design verification teams find that simulation alone cannot deliver the coverage or performance needed to get large, complex designs to market on time. If your design requires millions of clock cycles to fully verify, you need both simulation and emulation.

Leti's CoolCube 3D Transistor Stacking Improves with Qualcomm Help

04/27/2016  Collaborating to build out design to fabrication ecosystem.

Dow Corning previews upcoming products, showcases optical silicones benefits at LIGHTFAIR 2016

04/19/2016  Dow Corning will present an exclusive glimpse of upcoming products and technologies at LIGHTFAIR International 2016.

Roll-to-Roll Coating Technology: It's a Different Ball of Wax

04/18/2016  Manufacturing flexible electronics and coatings for a variety of products has some similarities to semiconductor manufacturing and some substantial differences, principally roll-to-roll fabrication, as opposed to making chips on silicon wafers and other rigid substrates. This interview is with Neil Morrison, senior manager, Roll-to-Roll Coating Products Division, Applied Materials.

IoT Demands Part 2: Test and Packaging

04/15/2016  To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.

IoT Demands Part 1: EDA and Fab Nodes

04/14/2016  To meet the anticipated needs of the different IoT application spaces, SemiMD asked leading companies within critical industry segments about the state of technology preparedness.

LED Taiwan kicks off in grand style

04/13/2016  The most influential LED exhibition in Taiwan adds pavilions for power devices and LED components.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

Date and time TBD / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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EVENTS



European MEMS Summit 2016
Stuttgart, Germany
http://www.semi.org/eu/node/8871
September 15, 2016 - September 16, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS