LED Manufacturing

LED MANUFACTURING ARTICLES



New multi-chip-LEDs provide a broad bright blue color range

08/06/2013 

Colors are playing an increasingly important role in the automotive sector. Consumers can not only choose the exterior color of the vehicle, you can also tailor the interior lighting to the customer’s individual taste.

Cree introduces industry’s first $99 LED street light

08/06/2013 

Cree, Inc. today announced a technology breakthrough for the LED street lighting market.

LED oversupply likely to continue as suppliers add production capacity

08/02/2013 

Despite a major surplus in the light-emitting diode (LED) market, top suppliers are increasing their capital spending and production because of government incentives and in order to cash in on an expected boom in the lighting business.

Epi-wafer market to grow to $4 billion in 2020 as LED lighting zooms to $80 billion

07/18/2013 

GaN-on-Sapphire remain the entrenched incumbent; leading challenger GaN-on-silicon will gain only a 10 percent market share, Lux Research says.

Scrubber developed for POU abatement of wet bench gases

07/18/2013 

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

Report forecasts that LED luminaire business will reach $516M market by 2016

06/12/2013 

Road and street lighting is a key driver for LED technology in general lighting.

Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Solid-state lighting expert Bernhard Stapp named to board of Aledia

05/22/2013 

Aledia today announced that solid-state lighting (SSL) industry veteran Dr. Bernhard Stapp has joined its board of directors.

GT Advanced Technologies acquires Thermal Technology LLC

05/16/2013 

GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.

LED ingot market to reach $325M by 2015

05/07/2013 

The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).

EMS debuts low-cost conductive LED die attach adhesive

04/29/2013 

Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Hitachi launches brand-new GaN-template product

04/26/2013 

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.

Memory, foundry and LED markets drive fab spending in southeast Asia

04/11/2013 

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.

Plessey is first to release GaN on silicon LEDs

04/08/2013 

Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.

University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

04/05/2013 

A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.

Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy

04/04/2013 

Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.

Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture

04/03/2013  p>Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its program with Aledia, its nanowire-LED partner.

Global LED lighting market will be worth $25.4 billion in 2013

03/27/2013 

The global LED lighting market will be worth $25.4 billion in 2013, representing 54% growth on the 2012 figure of $16.5, while the LED lighting penetration rate will also rise to 18.6%, according to a new DIGITIMES Research Special Report titled "Global high-brightness LED market forecast."

Aledia makes its first LEDS on 8-inch silicon wafers using microwire technology

03/27/2013 

Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.

Crystal IS announces record performance from a single chip UVC LED

03/21/2013 

Higher performance UVC LEDs help to realize ever more increasing range of customer applications including scientific instrumentation and water disinfection.




FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014