LED Manufacturing

LED MANUFACTURING ARTICLES



North America LED market to grow at 9.7% CAGR through 2022

11/11/2016  The North American LED market is expected to reach $11,702.6 Million by 2022.

Trace metal recombination centers kill LED efficiency

11/04/2016  UCSB researchers warn that trace amounts of transition metal impurities act as recombination centers in gallium nitride semiconductors.

Researchers surprised at the unexpected hardness of gallium nitride

10/31/2016  A Lehigh University team discovers that the widely used semiconducting material is almost as wear-resistant as diamonds.

What is your China strategy?

10/30/2016  Equipment vendors have a lot on their plates now, with memory customers pushing 3D NAND, foundries advancing to the 7 nm node, and 200mm fabs clamoring to come up with hard-to-find tools.

Sapphire industry: More than just LEDs

10/14/2016  LED remains the dominant sapphire application in 2016. Overall, rates of usage in smartwatches have been disappointing and have decreased below 2015 levels.

Samsung introduces LED modules based on chip scale packaging for spotlights and downlights

10/13/2016  Samsung Electronics Co., Ltd. today announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.

Nanoscale confinement leads to new all-inorganic perovskite with exceptional solar cell properties

10/12/2016  Scientists with the Energy Department's National Renewable Energy Laboratory (NREL) for the first time discovered how to make perovskite solar cells out of quantum dots and used the new material to convert sunlight to electricity with 10.77 percent efficiency.

Elusive Analog Fault Simulation Finally Grasped

09/27/2016  The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

09/21/2016  Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

Light and sound: LEDs seen acoustically

09/21/2016  Many LED failures are the result of voids or other gap-type anomalies that block heat flow from the die.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

New perovskite research discoveries may lead to solar cell, LED advances

09/09/2016  "Promising" and "remarkable" are two words U.S. Department of Energy's Ames Laboratory scientist Javier Vela uses to describe recent research results on organolead mixed-halide perovskites.

IC Insights updates semiconductor outlook for Internet of Things

09/07/2016  Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.

The sapphire industry: Back to the future

09/01/2016  “The sapphire industry is still plagued by overcapacity and rapid price declines,” asserts Yole Développement (Yole) in its latest report Sapphire Applications & Market 2016: LED & Consumer Electronics.

Global GaN semiconductor devices market is expected to be worth $3438.4M by 2024

08/31/2016  The global market for gallium nitride (GaN) semiconductor devices is largely consolidated, with the top four companies commanding a share of over 65% of the overall market in 2015, states Transparency Market Research (TMR) in a new report.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

Samsung introduces high-performance LED linear modules for indoor lighting applications

08/26/2016  Samsung Electronics Co., Ltd. today announced “H-series Gen 3,” a new line-up of LED linear modules that features high efficacy and enables easy replacement of fluorescent lights with LED lamps.

Following the UV curing boom, disinfection and purification applications are finally ready to take off

08/25/2016  In a short term, UV curing will drive the UV LED market, announces Yole Développement (Yole) in its new LED report entitled UV LEDs: Technology, Manufacturing and Applications Trends.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS