LED Manufacturing

LED MANUFACTURING ARTICLES



Cree announces the next generation of extreme high power LEDs

12/14/2016  The new XHP50.2 LED enables lighting manufacturers to quickly improve the performance of existing XHP50 lighting designs.

University of California, Berkeley places order for PEALD deposition system from Ultratech Cambridge Nanotech

12/08/2016  Ultratech, Inc. announced that the Laboratory for Emerging and Exploratory Devices has chosen the Ultratech-CNT Fiji G2 PEALD system as its instrument of choice for its research activities.

ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

LED packaging: New relays of growth are required for LED companies to survive

12/02/2016  According to Yole’s analysts, the packaged LED market represented a revenue of nearly US$15.7 billion in 2015. This industry should grow to a size of nearly US$18.2 billion by 2020.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

New LEDs may offer better way to clean water in remote areas

11/15/2016  Nanotech enables powerful and portable sterilization equipment.

North America LED market to grow at 9.7% CAGR through 2022

11/11/2016  The North American LED market is expected to reach $11,702.6 Million by 2022.

Trace metal recombination centers kill LED efficiency

11/04/2016  UCSB researchers warn that trace amounts of transition metal impurities act as recombination centers in gallium nitride semiconductors.

Researchers surprised at the unexpected hardness of gallium nitride

10/31/2016  A Lehigh University team discovers that the widely used semiconducting material is almost as wear-resistant as diamonds.

What is your China strategy?

10/30/2016  Equipment vendors have a lot on their plates now, with memory customers pushing 3D NAND, foundries advancing to the 7 nm node, and 200mm fabs clamoring to come up with hard-to-find tools.

Sapphire industry: More than just LEDs

10/14/2016  LED remains the dominant sapphire application in 2016. Overall, rates of usage in smartwatches have been disappointing and have decreased below 2015 levels.

Samsung introduces LED modules based on chip scale packaging for spotlights and downlights

10/13/2016  Samsung Electronics Co., Ltd. today announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.

Nanoscale confinement leads to new all-inorganic perovskite with exceptional solar cell properties

10/12/2016  Scientists with the Energy Department's National Renewable Energy Laboratory (NREL) for the first time discovered how to make perovskite solar cells out of quantum dots and used the new material to convert sunlight to electricity with 10.77 percent efficiency.

Elusive Analog Fault Simulation Finally Grasped

09/27/2016  The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

09/21/2016  Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

Light and sound: LEDs seen acoustically

09/21/2016  Many LED failures are the result of voids or other gap-type anomalies that block heat flow from the die.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

New perovskite research discoveries may lead to solar cell, LED advances

09/09/2016  "Promising" and "remarkable" are two words U.S. Department of Energy's Ames Laboratory scientist Javier Vela uses to describe recent research results on organolead mixed-halide perovskites.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS