LED Manufacturing

LED MANUFACTURING ARTICLES



EV Group ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL Track System

07/07/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's SmartNIL large-area nanoimprint lithography (NIL) process in a single platform.

OEM Group expands wafer surface preparation services to UBLED processing

07/06/2015  Global semiconductor capital equipment manufacturer OEM Group announced today it has received first-in-fab and repeat tool orders for its Cintillio wet chemical processing system from several leading Ultra Bright LED manufacturers working in the automotive lighting market.

EMC2015 - New Devices, Old Tricks

06/30/2015  The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into the process-structure-properties relationships of electronic devices now running in high-volume manufacturing (HVM) lines globally.

Photolithography equipment & materials market is attracting new players, but success is not guaranteed

06/29/2015  Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex roadmaps.

Solid State Watch: June 19-25, 2015

06/26/2015  IHS says Moore’s Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting record sales in 2015; Nanowires could be the LEDs of the future

Nanowires could be the LEDs of the future

06/25/2015  The latest research from the Niels Bohr Institute shows that LEDs made from nanowires will use less energy and provide better light.

Ultratech Cambridge NanoTech ships 400th ALD system

06/24/2015  The system was purchased by the University of Michigan.

Breaking Down Power Management Verification

06/22/2015  During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

3DIC Technology Drivers and Roadmaps

06/22/2015  Circuit performance and silicon area improvements seen in new die stacks.

Aledia completes $31M Series B financing

06/18/2015  Aledia, a developer and manufacturer of next-generation 3D LEDs based on its Gallium-Nitride-on-Silicon platform, announced today the closing of its Series B financing round and the execution of development and supply contracts with major LED buyers.

Dow Corning granted Korean patent for LED optical silicone encapsulant technology

06/17/2015  Dow Corning reported today that the Korean Intellectual Property Office (KIPO) granted a patent protecting the company’s high refractive index (RI) phenyl-based optical silicone encapsulant technology, which targets advanced LED lighting applications.

Pixelligent closes $3.4M in funding

06/16/2015  Pixelligent Technologies, producer of PixClear, a producer of nanocrystal dispersions for demanding applications in LED lighting, OLED Lighting, and Optical Coatings & Films markets, announced today that it closed $3.4 million in new funding.

Trans-Lux announces new LED manufacturing resources

06/16/2015  Trans-Lux today announced the opening of a new design and production facility in Shenzhen, China to complement its existing manufacturing operations in Des Moines, IA.

Three trends driving optoelectronics market growth through 2019

06/09/2015  Laser transmitters, CMOS image sensors, and high-brightness LEDs will be key to expansion.

Next-generation illumination using silicon quantum dot-based white-blue LED

06/09/2015  A hybrid LED is expected to be a next-generation illumination device for producing flexible lighting and display, and this is achieved for the Si QD-based white-blue LED.

Tackling Parameter Extraction for 16nm and Below

06/08/2015  There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in more complex electrical fields around the device 2) multi-patterning, which causes increased variability; 3) a demand for 10X tighter levels of accuracy, and 4) increased levels of secrecy from foundries and designers.

Leti demos new process to fabricate high-brightness micro-LED arrays for next-gen head-mounted and head-up displays

06/02/2015  CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

Intel CEO looks to 3D tech at display conference

06/02/2015  Intel CEO Brian Krzanich touted the capabilities of his company’s RealSense technology in a keynote address at the Society for Information Display conference in San Jose, California.

Silicon Technology Extensions shown at MRS Spring 2015

06/01/2015  New ultra-fast crystallization using lasers or plasma-jets.

SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings

05/21/2015  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS