12/03/2015 Hybrid optoelectronic devices based on blends of hard and soft semiconductors can combine the properties of the two material types, opening the possibility for devices with novel functionality and properties, such as cheap and scalable solution-based processing methods.
11/30/2015 ITRI and TSMC co-develop aerosol method to monitor liquids and slurries.
11/30/2015 Vacuum nanowire arrays of cold cathodes for high frequency sources and amplifiers
11/30/2015 Cambridge Nanotherm, a producer of thermal management technology, has won the "LED Lighting Product of the Year" award at the 2015 Elektra Awards for its "Nanotherm DM" product.
11/24/2015 Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments - Austin division.
11/23/2015 InvenSense president and chief executive officer Behrooz Abdi sees the Internet of Things as an Internet of Sensors, a theme he explored Tuesday afternoon (November 17) at the opening of the fourth annual InvenSense Developers Conference.
11/23/2015 The second day of the InvenSense Developers Conference saw presenters get down to cases – use cases for sensors.
11/17/2015 The use of sapphire in the manufacturing of Light Emitting Diodes (LEDs) is covered in the second part of a two part series.
11/16/2015 Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of Flip Chip technology for LED and CMOS Image Sensors (CIS) applications, the Flip Chip market is expending.
11/16/2015 The Phil Kaufman Award is presented by the Electronic Design Automation Consortium (EDAC) and the IEEE Council on Electronic Design Automation (CEDA). It honors the memory of Philip A. Kaufman, the EDA industry pioneer, electronics engineer, and entrepreneur, who died in 1992.
11/13/2015 Systematic – and predictive – cost reduction in semiconductor equipment manufacturing
11/13/2015 Sapphire is hard, strong, optically transparent and chemically inert.
11/11/2015 Pixelligent launched a new family of PixClear materials for display and optical components and films.
11/09/2015 A wide variety of microelectromechanical system (MEMS) devices, sensors, and MEMS sensors were described and introduced at the MEMS Executive Congress US in Napa, Calif.
11/09/2015 Not all segments in MEMS and sensors are enjoying hockey-stick growth forecasts, as commoditization and pricing pressures take hold. This was just one of the insights gleaned at last week’s MEMS Executive Congress US 2015.
11/05/2015 China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.
11/04/2015 Much has changed in the world of microelectromechanical system (MEMS) devices in the past 20 years, and much more will change in the next two decades, said Steve Nasiri of Nasiri Ventures in his keynote address Wednesday (November 4) at the MEMS Executive Congress US conference in Napa, Calif.
11/03/2015 Plasma-Therm announced that it has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal.
11/02/2015 On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.
11/02/2015 Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.
November 15, 2016 at 1:00 p.m. ET / Sponsored by Brewer Science
Directed self-assembly (DSA) patterning is one of the primary methods being pursued for future advanced patterning nodes. Since DSA’s initial introduction in the early 2000s, great progress has been made. However, many challenges remain for achieving manufacturing readiness. Key improvements in the areas of materials, defectivity, and process integration are still needed. This webcast will cover published progress to date, review key improvements needed, and discuss new advances in DSA technology. Results from CEA-LETI’s 300-mm lab-to-fab for validation of DSA’s manufacturing readiness will be discussed.
November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics
Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.