LED Packaging and Testing

MAGAZINE



LED PACKAGING AND TESTING ARTICLES



RayVio announces expansion of UV LED manufacturing capacity

08/28/2015  RayVio Corporation, a developer of deep ultraviolet (UV) LEDs and integrated solutions, announced today that they are expanding their international sales force, and manufacturing capacity. The facility expansion at the original site is scheduled to be complete by year-end.

"Quantum dot" technology may help light the future

08/19/2015  Advances at Oregon State University in manufacturing technology for “quantum dots” may soon lead to a new generation of LED lighting that produces a more user-friendly white light, while using less toxic materials and low-cost manufacturing processes that take advantage of simple microwave heating.

SUSS MicroTec announces new competence-center for nanoimprint in North America

08/18/2015  SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field of nanoimprint technologies.

New research may enhance display & LED lighting technology

08/10/2015  Researchers from the University of Illinois at Urbana-Champaign have produced some promising results toward that goal, developing a new method to extract more efficient and polarized light from quantum dots (QDs) over a large-scale area.

Pixelligent launches new PixClear light extraction materials for OLED lighting

08/03/2015  Pixelligent Technologies, a manufacturer of high index materials for demanding optoelectronics applications, announces the addition of four new OLED lighting products to its PixClear Zirconia nanocrystal family.

Apple is using 20% of worldwide sapphire capacity – and that may be just the beginning

07/31/2015  In 2015, 20 percent of sapphire will be used in Apple’s iPhone, for the camera lens, fingerprint readers and heart rate monitors covers, and the Apple watch’s window.

Opportunities in packaging are driving photolithography equipment demand

07/27/2015  Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

Superfast fluorescence sets new speed record

07/27/2015  Researchers have developed an ultrafast light-emitting device that can flip on and off 90 billion times a second and could form the basis of optical computing.

Sticky tape and phosphorus the key to ultrathin solar cells

07/21/2015  Scientists studying thin layers of phosphorus have found surprising properties that could open the door to ultrathin and ultralight solar cells and LEDs.

OEM Group expands wafer surface preparation services to UBLED processing

07/06/2015  Global semiconductor capital equipment manufacturer OEM Group announced today it has received first-in-fab and repeat tool orders for its Cintillio wet chemical processing system from several leading Ultra Bright LED manufacturers working in the automotive lighting market.

MORE LED-PACKAGING-AND-TESTING ARTICLES

TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015