LED Packaging and Testing

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LED PACKAGING AND TESTING ARTICLES



Laser marking meets diverse challenges in fab and packaging

09/22/2017  The basics of laser marking are reviewed, as well as current and emerging laser technologies.

Seoul Semiconductor files patent litigation for infringement of 12 Acrich patents

09/19/2017  Seoul Semiconductor Co., Ltd. announced on Sept. 19, 2017 that it has filed a patent infringement lawsuit, together with its affiliate, Seoul Viosys Co., Ltd., against Archipelago Lighting, Inc. in the U.S. District Court for the Central District of California.

Samsung’s new Q-series LED linear modules offer superior efficacy to improve premium indoor lighting

08/24/2017  Samsung Electronics Co., Ltd. today announced the launch of the “Q-series,” a new line-up of LED linear modules for use in premium indoor luminaire applications where an exceptionally high level of light efficacy* is required.

ROHM's new ultra-compact low profile 2-color chip LEDs

08/24/2017  Industry-small form factor contributes to thinner, more vibrant displays in industrial and consumer devices.

Infrared laser: At the heart of the industry in coming years

08/23/2017  In a depressed visible LED industry, manufacturers are looking at new opportunities to increase their revenues and margins. In this context, the IR LED market is perceived as a potential new ‘blue ocean’ with attractive opportunities for those players.

Seoul Semiconductor achieves continuous revenue growth

08/01/2017  The year over year rise in automotive lighting sales proved highly profitable for the company.

TrendForce reports 'micro LED-like' products will be available in 2018

07/21/2017  Breakthroughs in mass transfer have yet to materialize.

Harnessing hopping hydrogens for high-efficiency OLEDs

07/10/2017  Researchers at Kyushu University's Center for Organic Photonics and Electronics Research (OPERA) demonstrated that a molecule that slightly changes its chemical structure before and after emission can achieve a high efficiency in organic light-emitting diodes (OLEDs).

Pixelligent Technologies awarded $2.15M in grant funding from U.S. Departments of Energy, Defense

07/10/2017  Pixelligent Technologies, a nanocomposite advanced materials manufacturer, announced today that it has been awarded grant funding from the Department of Energy SBIR program and the Department of Defense STTR program, that totals a combined $2.15 million

Umicore inaugurates new production facility in Germany

06/29/2017  Umicore’s business unit Precious Metals Chemistry today inaugurated its production unit for advanced metal organic precursor technologies used in the semiconductor and LED markets.

Pixelligent Technologies named 2017 Manufacturer of the Year by Frost & Sullivan

06/19/2017  It won this award in the small/midsize company category for companies with revenues under $1B, for its PixClearProcess that is revolutionizing chemical composite technology.

Samsung achieves 220 lumens per watt with new mid-power LED package

06/15/2017  Samsung Electronics Co., Ltd. today announced that it has begun mass producing a new mid-power LED package, the LM301B, which features the industry's highest luminous efficacy of 220 lumens per watt.

Osram's next-generation of LEDs set new standards in miniaturization

06/14/2017  Osram Opto Semiconductors today presented the latest generation of surface-mountable LED, the Topled E1608, with a package smaller than its predecessor models by a factor of 20.

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3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS