LED Packaging and Testing

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LED PACKAGING AND TESTING ARTICLES



Building crystals on a very hot surface

04/19/2018  A chemical reactor that operates at extremely high temperatures is being developed by KAUST and could improve the efficiency and economy of a commonly used process in the semiconductor industry, with flow-on benefits for Saudi Arabia's chemical industry.

Pixelligent Technologies closes $7.6M round of investments

04/19/2018  Latest funding will accelerate product commercialization and global customer adoption.

Toyoda Gosei achieves state-of-the-art high current operation with vertical GaN power semiconductor

04/16/2018  Toyoda Gosei Co., Ltd. has achieved state-of-the-art high current operation in a vertical GaN power semiconductor developed using gallium nitride (GaN), a main material in blue LEDs.

Cree licenses GaN power patents to Nexperia

04/12/2018  Cree, Inc. announces that it signed a non-exclusive, worldwide, royalty-bearing patent license agreement with Nexperia BV, a Dutch company.

Veeco wins compound semiconductor industry innovation award

04/11/2018  Flexible GENxcel™ MBE Deposition System earns Veeco its fourth Innovation Award in seven years.

ON Semiconductor selects Veeco tool for GaN electronics manufacturing

04/10/2018  Veeco Instruments Inc. today announced that ON Semiconductor (Nasdaq: ON) has ordered its Propel High-volume Manufacturing (HVM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system.

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

Osram and Continental sign joint venture contract

04/03/2018  Technology companies Osram and Continental have successfully completed negotiations on their joint venture, which is expected to begin operations in the second half of calendar year 2018.

Apple developing all key elements of microLED display technology

03/29/2018  If we did not know before, now we are all aware: microLEDs for display applications is a very hot topic and Apple is strongly commited to the development of its own technology.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

SPONSORED: At LED Expo Thailand 2018, exhibition space is filling up fast. Hurry, book your space now!

03/19/2018  The 6th annual LED Expo Thailand 2018, which is aimed at bringing together LED & lighting industry with buyers, specialists and suppliers to the Challenger 1, IMPACT Exhibition Center in Bangkok, Thailand on May 10-12, 2018.

Si2 approves two IC design simulation standards for fast-growing gallium nitride market

03/14/2018  The Silicon Integration Initiative's (Si2) Compact Model Coalition (CMC) has approved two integrated circuit design simulation standards that target the fast-growing global market for gallium nitride semiconductors.

UCLA researchers develop a new class of two-dimensional materials

03/09/2018  New kinds of 'superlattices' could lead to improvements in electronics, from transistors to LEDs.

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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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