LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Intematix appoints Jerry Turin as CFO

10/23/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, today announced Jerry Turin as the company's Chief Financial Officer.

Cree's new SC5 Technology Platform doubles light output to radically lower system cost

10/23/2014  This new class of LEDs can reduce system costs by up to 40 percent in most lighting applications.

Beyond LEDs: Brighter, new energy-saving flat panel lights based on carbon nanotubes

10/16/2014  Planar light source using a phosphor screen with highly crystalline single-walled carbon nanotubes (SWCNTs) as field emitters demonstrates its potential for energy-efficient lighting device.

Revving up fluorescence for superfast LEDs

10/13/2014  Duke University researchers have made fluorescent molecules emit photons of light 1,000 times faster than normal -- setting a speed record and making an important step toward realizing superfast light emitting diodes (LEDs) and quantum cryptography.

LED Nobel Prize invention leads to $17.7B market and 250,000+ jobs

10/10/2014  The 2014 Nobel Prize for physics awarded today to three physicists for their invention of blue light-emitting diodes (LED) led to a significant breakthrough and paved the way for the creation of white light—a cleaner, more energy-efficient and longer-lasting source of illumination that also has generated a multibillion-dollar market and the creation of hundreds of thousands of jobs.

Seoul Semiconductor announces the mass production of the Acrich MJT 3030

10/09/2014  Seoul Semiconductor, a global LED manufacturer, announced the availability of Acrich MJT 3030 a new LED in the Acrich MJT product family which improves on performance and enables lower system costs.

Advanced packaging technologies are changing the LED manufacturing supply chain

10/08/2014  At the LED packaging equipment level, growth will return for the next three years.

Soraa founder wins Nobel Prize in physics

10/07/2014  Soraa, a developer of GaN on GaN LED technology, announced today that one of its founders, Dr. Shuji Nakamura, has been awarded the 2014 Nobel Prize in Physics.

Pixelligent Technologies announces $1.25M solid-state lighting award from the Department of Energy

09/23/2014  Pixelligent Technologies announced today that it has been selected for a Department of Energy (DOE) solid-state-lighting award to support the continued development of its OLED lighting application.

In the LED packaging world, Flip Chip technology is rising

09/19/2014  In the LED packaging world, a wind of change is blowing. A LED TV crisis, and new Chinese players have totally modified the LED industry and its supply chain.

New research proves whiteness and color rendering has strong effect on LED lamp preference

09/18/2014  Soraa, a developer of GaN on GaN LED technology, announced today new psychophysical research proving that whiteness and color rendering have a strong effect on the perception of energy-efficient LED lighting.

Kateeva receives $38 million in financing

09/15/2014  Kateeva announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC).

Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

09/10/2014  CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

Intematix and SABIC collaborate to deliver increased efficiency solutions for LED systems

09/09/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, has collaborated with SABIC's Innovative Plastics business to create the ChromaLit Linear - a LED offering developed for the lighting industry.

Cree SiC MOSFETs help power Japan’s growing solar energy infrastructure

09/08/2014  Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

Seoul Semiconductor launches smart lighting Acrich LED Light Engine

08/28/2014  Seoul Semiconductor announced the release of a new LED light engine with Acrich 3 technology.

SemiLEDs launches EF FlipChip LED series

08/27/2014  SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.

Quantum Materials acquires Bayer Technology Services quantum dot patents

08/20/2014  Quantum Materials Corporation today announced the purchase of five diverse sets of patent families from Bayer Technology Services GmbH, the global technological backbone and major innovation driver for Bayer AG of Leverkusen, Germany.

Ushio to expand solid-state light source business with Oclaro Japan acquisition

08/15/2014  The closing of the transaction is expected to occur during the fourth calendar quarter of 2014.

LightFair International 2015 call for speakers opens

08/15/2014  The LIGHTFAIR International (LFI) 2015 Call for Speakers opens in a global invitation seeking responses from top lighting and design practitioners looking to participate in the world's largest annual architectural and commercial lighting trade show and conference in New York May 3-7, 2015.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

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VIDEOS