LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Ultratech receives multiple system, follow-on order for fan-out wafer-level packaging applications

06/28/2016  Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

SiC power business is a reality

06/27/2016  Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.

Samsung introduces new line-up of LED components for automotive lighting, featuring chip-scale packaging

06/21/2016  Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

Ultratech enables world's lowest contact resistivity for finFETs with LXA melt laser annealing technology

06/16/2016  This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.

WPG Americas Inc. announces distribution agreement with Seoul Semiconductor

06/15/2016  WPG Americas Inc. announced today it has signed a new agreement with Seoul Semiconductor the world's fifth largest LED supplier to distribute their full complete line of products.

Novel capping strategy improves stability of perovskite nanocrystals

06/14/2016  Study addresses instability issues with organometal-halide perovskites, a promising class of materials for solar cells, LEDs, and other applications.

The sapphire industry: What’s next?

06/10/2016  Almost two years after GTAT’s bankruptcy, the sapphire industry is still there. Its decor and characters have, of course, changed but the story is still unfolding.

Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

Engineers discover a new gatekeeper for light

05/27/2016  Finding paves the way for devices that switch quickly between transparency and opacity to specific forms of light.

Automotive LED industry drivers: Disruptive technologies and consumer behavior changes

05/20/2016  The lighting market for automotive applications should reach a 23.7% compound annual growth rate (CAGR) 2015-2121 reaching a US$27.7 billion market in 2021.

$88M in Series E financing for OLED production equipment maker, Kateeva

05/19/2016  Kateeva today announced that it has closed its Series E funding round with $88 million in new financing.

Monolithic Schottky diode in ST F7 LV MOSFET technology: Performance improvement in application

05/11/2016  Standard solutions and devices are compared to a 60 V MOSFET with monolithic Schottky diode as evaluated in SMPS and motor control environments.

Dow Corning previews upcoming products, showcases optical silicones benefits at LIGHTFAIR 2016

04/19/2016  Dow Corning will present an exclusive glimpse of upcoming products and technologies at LIGHTFAIR International 2016.

LED Taiwan kicks off in grand style

04/13/2016  The most influential LED exhibition in Taiwan adds pavilions for power devices and LED components.

Quantum dots enhance light-to-current conversion in layered semiconductors

04/08/2016  Harnessing the power of the sun and creating light-harvesting or light-sensing devices requires a material that both absorbs light efficiently and converts the energy to highly mobile electrical current.

Becoming crystal clear

04/06/2016  UCSB researchers identify specific defects in LED diodes that lead to less efficient solid state lighting.

Samsung and Daintree partner to advance smart building IoT

03/24/2016  Samsung Electronics Co. and Daintree Networks said they are collaborating on joint solutions involving Samsung's smart lighting module (SLM).

The United States leads growing global industrial semiconductor market

03/22/2016  The industrial semiconductor market will post an 8 percent compound annual growth rate (CAGR), as revenue rises from $43.5 billion in 2014 to $59.5 billion in 2019.

Soraa supports TM-30 as a superior color test for the lighting industry

03/14/2016  Soraa, a developer of GaN on GaN LED technology, today announces its support for advances in color science and the new TM-30 method released by the Illuminating Engineering Society (IES).

Artificial control of exciplexes opens possibilities for new electronics

02/26/2016  Researchers at Kyushu University were able to widely vary the emission color and efficiency of OLEDs.




TWITTER


WEBCASTS



Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS