LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



First Chinese supplier breaks into Top 10 LED rankings in 2013

07/16/2014  China’s massive investments in light-emitting diode (LED) manufacturing capacity are paying off, with a Chinese company entering the top ranks of the global market for the first time ever

Lighting accounted for one-quarter of all LED driver IC revenue in 2013

07/16/2014  One out of every four dollars spent worldwide on light-emitting diode (LED) drivers in 2013 was used for lighting applications, illustrating the growing importance of illumination in the LED business.

Crystal IS introduces Optan LED technology

06/12/2014  Crystal IS, a developer of high-performance ultraviolet (UVC) LEDs, this week announced availability of Optan.

Dow Corning silicone wins Innovation Award at 2014 LIGHTFAIR International

06/05/2014  This marks the third time in two years that Dow Corning’s Moldable Silicone product technology has garnered top recognition during LIGHTFAIR International’s (LFI) annual awards.

Samsung improves color rendering in its LED components

06/02/2014  Samsung Electronics today announced that it has improved the light quality of its LED packages and modules based on a 90 CRI (Color Rendering Index) for use in advanced lighting applications.

Seoul Semiconductor launches high power Acrich package for outdoor lighting

05/28/2014  Seoul Semiconductor this week announced the release of a new generation of Acrich MJT 5050 LEDs, with high lumen output, reliability, and cost performance optimized for the outdoor lighting market.

Crystal IS primes for transition to commercial manufacturing

05/20/2014  Crystal IS, a developer of the most effective UVC LEDs, today announced the appointment of John Gartner as its first vice president of operations.

Cree announces low cost extended bandwidth GaN HEMT transistors

05/07/2014  In response to broader bandwidth demand, Cree, Inc. introduces a family of GaN HEMT RF transistors that delivers industry-leading bandwidth and high efficiency performance to support today’s busy LTE networks.

Veeco appoints Shubham Maheshwari as chief financial officer

05/06/2014  Mr. Maheshwari replaces David D. Glass, who announced his retirement from Veeco last December.

More GaN-on-Si players on the playground, business is starting

04/24/2014  GaN-on-Si is entering in production. Under this context, what is the patent situation?

Epistar extends collaboration with Intermolecular

04/24/2014  Intermolecular, Inc. today announced that Epistar Corp. and Intermolecular have signed a multi-year extension of their existing collaborative development program (CDP) and royalty-bearing IP licensing agreement to increase the efficiency and reduce the cost of Epistar's light emitting diode (LED) devices.

Dow Corning moves to defend Chinese patent for LED optical silicone encapsulants

04/17/2014  Dow Corning filed a complaint through its Chinese subsidiary and licensee with the Shanghai First Intermediate Court.

Leti to demonstrate wireless high data rate Li-Fi prototype

03/27/2014  CEA-Leti will demonstrate its new prototype for wireless high data rate Li-Fi (light fidelity) transmission at Light + Building 2014 in Frankfurt, Germany, March 30-April 4. The technology employs the high-frequency modulation capabilities of light-emitting diode (LED) engines used in commercial lighting.

Samsung introduces new flip chip LED packages

03/27/2014  Samsung today introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability.

New technique makes LEDs brighter, more resilient

03/21/2014  Researchers from North Carolina State University have developed a new processing technique that makes light emitting diodes (LEDs) brighter and more resilient by coating the semiconductor material gallium nitride (GaN) with a layer of phosphorus-derived acid.

GaN-on-Si enables GaN power electronics, will LED transition as well?

03/19/2014  Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost.

Double digit growth for China LED production in 2014

03/10/2014  Following the boom in expansion of the Chinese LED market in 2011, many industry insiders and analysts speculated on whether the Chinese would be able to sustain the growth, or if many companies simply ordered an excessive amount of MOCVD reactors just to benefit from government subsidies.

Cree introduces the industry's most powerful SiC Schottky diodes

03/05/2014  Cree today introduced the new CPW5 Z-Rec high-power silicon-carbide (SiC) Schottky diodes, the industry’s first commercially available family of 50 Amp SiC rectifiers.

EVG and Brisbane Materials introduce novel anti-reflective coating solution for LED lighting applications

02/25/2014  The jointly developed manufacturing solution enables lumen output increases of up to eight percent.

Soraa develops the world's most efficient LEDs

02/24/2014  Soraa announced today the world’s most efficient LED, which it will integrate into the market’s first full-visible-spectrum, large form factor lamps.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Wet Processing

July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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