10/14/2016 LED remains the dominant sapphire application in 2016. Overall, rates of usage in smartwatches have been disappointing and have decreased below 2015 levels.
10/13/2016 Samsung Electronics Co., Ltd. today announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.
09/21/2016 The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.
09/19/2016 As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.
09/09/2016 "Promising" and "remarkable" are two words U.S. Department of Energy's Ames Laboratory scientist Javier Vela uses to describe recent research results on organolead mixed-halide perovskites.
09/07/2016 Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.
09/01/2016 “The sapphire industry is still plagued by overcapacity and rapid price declines,” asserts Yole Développement (Yole) in its latest report Sapphire Applications & Market 2016: LED & Consumer Electronics.
08/26/2016 Samsung Electronics Co., Ltd. today announced “H-series Gen 3,” a new line-up of LED linear modules that features high efficacy and enables easy replacement of fluorescent lights with LED lamps.
08/25/2016 In a short term, UV curing will drive the UV LED market, announces Yole Développement (Yole) in its new LED report entitled UV LEDs: Technology, Manufacturing and Applications Trends.
08/18/2016 IHS Markit released its annual 2015 revenue-share ranking of the top LED suppliers in backlighting, automotive, lighting and other applications.
08/15/2016 Pixelligent Technologies, a developer of high-index advanced materials for solid state lighting and display applications and producer of PixClear products, announced today that it closed $10.4 million in new funding.
08/12/2016 Veeco Instruments Inc. announced today that Epistar Corporation has ordered multiple TurboDisc EPIK 700 GaN MOCVD Systems for the production of LEDs.
08/10/2016 Metal-organic frameworks with a piggyback structure open up new possibilities for solar cells and LEDs -- publication in the Advanced Materials scientific journal.
07/29/2016 Researchers at the University of Illinois at Urbana Champaign have developed a new method for making brighter and more efficient green light-emitting diodes.
07/19/2016 The gallium nitride (GaN) substrates market is set to cross $4 billion USD by 2020, according to the market research report from IndustryARC.
07/15/2016 A collaboration of researchers from Kumamoto, Yamaguchi, and Osaka Universities in Japan have discovered a new method of drastically changing the color and fluorescence of a particular compound using only oxygen (O2) and hydrogen (H2) gases.
06/28/2016 Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.
06/27/2016 Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.
06/21/2016 Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.
06/16/2016 This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.
October 26, 2016 at 1 p.m. ET / Sponsored by Air Products
With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.
November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics
Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.