LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Intematix appoints Jerry Turin as CFO

10/23/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, today announced Jerry Turin as the company's Chief Financial Officer.

Cree's new SC5 Technology Platform doubles light output to radically lower system cost

10/23/2014  This new class of LEDs can reduce system costs by up to 40 percent in most lighting applications.

Beyond LEDs: Brighter, new energy-saving flat panel lights based on carbon nanotubes

10/16/2014  Planar light source using a phosphor screen with highly crystalline single-walled carbon nanotubes (SWCNTs) as field emitters demonstrates its potential for energy-efficient lighting device.

Deeper Dive -- Mentor Graphics Looks to the Future

10/14/2014  There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

Revving up fluorescence for superfast LEDs

10/13/2014  Duke University researchers have made fluorescent molecules emit photons of light 1,000 times faster than normal -- setting a speed record and making an important step toward realizing superfast light emitting diodes (LEDs) and quantum cryptography.

LED Nobel Prize invention leads to $17.7B market and 250,000+ jobs

10/10/2014  The 2014 Nobel Prize for physics awarded today to three physicists for their invention of blue light-emitting diodes (LED) led to a significant breakthrough and paved the way for the creation of white light—a cleaner, more energy-efficient and longer-lasting source of illumination that also has generated a multibillion-dollar market and the creation of hundreds of thousands of jobs.

Seoul Semiconductor announces the mass production of the Acrich MJT 3030

10/09/2014  Seoul Semiconductor, a global LED manufacturer, announced the availability of Acrich MJT 3030 a new LED in the Acrich MJT product family which improves on performance and enables lower system costs.

Advanced packaging technologies are changing the LED manufacturing supply chain

10/08/2014  At the LED packaging equipment level, growth will return for the next three years.

Soraa founder wins Nobel Prize in physics

10/07/2014  Soraa, a developer of GaN on GaN LED technology, announced today that one of its founders, Dr. Shuji Nakamura, has been awarded the 2014 Nobel Prize in Physics.

Pixelligent Technologies announces $1.25M solid-state lighting award from the Department of Energy

09/23/2014  Pixelligent Technologies announced today that it has been selected for a Department of Energy (DOE) solid-state-lighting award to support the continued development of its OLED lighting application.

SPIE Photomask Technology Wrap-up

09/23/2014  Extreme-ultraviolet lithography was a leading topic at the SPIE Photomask Technology conference and exhibition, held September 16-17-18 in Monterey, Calif., yet it wasn’t the only topic discussed and examined. Mask patterning, materials and process, metrology, and simulation, optical proximity correction (OPC), and mask data preparation were extensively covered in conference sessions and poster presentations.

In the LED packaging world, Flip Chip technology is rising

09/19/2014  In the LED packaging world, a wind of change is blowing. A LED TV crisis, and new Chinese players have totally modified the LED industry and its supply chain.

SPIE panel tackles mask complexity issues

09/19/2014  Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?

New research proves whiteness and color rendering has strong effect on LED lamp preference

09/18/2014  Soraa, a developer of GaN on GaN LED technology, announced today new psychophysical research proving that whiteness and color rendering have a strong effect on the perception of energy-efficient LED lighting.

ASML on EUV: Available at 10nm

09/17/2014  Extreme-ultraviolet lithography systems will be available to pattern critical layers of semiconductors at the 10-nanometer process node, and EUV will completely take over from 193nm immersion lithography equipment at 7nm, according to Martin van den Brink, president and chief technology officer of ASML Holding.

Design and Manufacturing Technology Development in Future IC Foundries

09/16/2014  Virtual Roundtable provides perspective on the need for greater integration within the “fabless-foundry” ecosystem.

Monolithic 3D breakthrough at IEEE S3S 2014

09/15/2014  In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) could be built using the existing fab and the existing transistor flow.

Kateeva receives $38 million in financing

09/15/2014  Kateeva announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC).

Process Watch: Sampling matters

09/15/2014  Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

09/15/2014  A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies for process technology development and design flow enhancement.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

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VIDEOS