LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

09/10/2014  CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

Research Alert: September 9, 2014

09/09/2014  GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students; Layered graphene sandwich for next generation electronics; Doped graphene nanoribbons with potential

Intematix and SABIC collaborate to deliver increased efficiency solutions for LED systems

09/09/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, has collaborated with SABIC's Innovative Plastics business to create the ChromaLit Linear - a LED offering developed for the lighting industry.

Cree SiC MOSFETs help power Japan’s growing solar energy infrastructure

09/08/2014  Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

The Week in Review: September 5, 2014

09/05/2014  New non-volatile memory technology; President and CEO of FSA announced; Samsung to use ProPlus 14nm finFET SPICE modeling platform; MEMS gyroscope from Analog Devices; SEMICON Taiwan held this week

Research Alert: September 3, 2014

09/03/2014  A new, tunable device for spintronics; Copper shines as flexible conductor; Competition for graphene

Intel Announces “New Interconnect” for 14nm

09/02/2014  Intel has just announced that “Embedded Multi-die Interconnect Bridge (EMIB”) packaging technology will be available to 14nm foundry customers.

The Week in Review: August 29, 2014

08/29/2014  Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu's new foundry company; Thinnest-possible semiconductor; SEMI announces keynotes for Vietnam Semiconductor Strategy Summit

Lithography: What are the alternatives to EUV?

08/28/2014  Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

Seoul Semiconductor launches smart lighting Acrich LED Light Engine

08/28/2014  Seoul Semiconductor announced the release of a new LED light engine with Acrich 3 technology.

SemiLEDs launches EF FlipChip LED series

08/27/2014  SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.

The Week in Review: August 22, 2014

08/22/2014  Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone

Quantum Materials acquires Bayer Technology Services quantum dot patents

08/20/2014  Quantum Materials Corporation today announced the purchase of five diverse sets of patent families from Bayer Technology Services GmbH, the global technological backbone and major innovation driver for Bayer AG of Leverkusen, Germany.

The Week in Review: August 15, 2014

08/15/2014  The growing semiconductor market in India; MEMSIC's monolithic, wafer-level packaged accelerometer; Si2 adds new director of 3DIC Programs; Worldwide silicon wafer area shipments increased during the second quarter 2014; LightFair announces Call for Speakers

Ushio to expand solid-state light source business with Oclaro Japan acquisition

08/15/2014  The closing of the transaction is expected to occur during the fourth calendar quarter of 2014.

LightFair International 2015 call for speakers opens

08/15/2014  The LIGHTFAIR International (LFI) 2015 Call for Speakers opens in a global invitation seeking responses from top lighting and design practitioners looking to participate in the world's largest annual architectural and commercial lighting trade show and conference in New York May 3-7, 2015.

Seoul Semiconductor moves in to the Top 5 global LED manufacturers

08/08/2014  This is a step up from the 2012 ranking of number five global LED manufacturer despite any internal captive revenue.

Apple saved the sapphire industry in 2013 and could transform it in 2014

08/05/2014  In 2013, Apple completely saved the sapphire industry. This year, in 2014, Apple could transform this industry. Will the revolution happen?

Atomic Layer Etch now in Fab Evaluations

08/04/2014  Lam’s CTO talks about the future of etch in beta-site tests.

Cambridge Nanotherm appoints Ralph Weir as CEO

07/31/2014  Cambridge Nanotherm, a producer of semiconductor heatsink technology, today announced that it has appointed semiconductor industry veteran Ralph Weir as its CEO.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Extending Moore's Law

January 2015 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2015 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015