LEDs

LEDS ARTICLES



Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Can lean innovation bring growth and profits back to semiconductors?

07/25/2014  New approaches to start-ups can unlock mega-trend opportunities.

SEMI announces new South America Semiconductor Strategy Summit

07/22/2014  SEMI today announced the launch of the association's first-ever event in Latin America.

First Chinese supplier breaks into Top 10 LED rankings in 2013

07/16/2014  China’s massive investments in light-emitting diode (LED) manufacturing capacity are paying off, with a Chinese company entering the top ranks of the global market for the first time ever

Lighting accounted for one-quarter of all LED driver IC revenue in 2013

07/16/2014  One out of every four dollars spent worldwide on light-emitting diode (LED) drivers in 2013 was used for lighting applications, illustrating the growing importance of illumination in the LED business.

Power supply market to grow by $3.5B in four years

07/16/2014  The global market outlook for AC-DC and DC-DC power supplies is set for healthy expansion starting this year until at least 2018, with revenue during these four years projected to grow by $3.5 billion.

SEMI forecasts double-digit business growth in 2014, 2015

07/09/2014  The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

07/08/2014  Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

Permanent bonding: A key technology for MEMS, advanced packaging, LEDs and SOI

07/07/2014  Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

Internet of Things: big numbers, many opportunities

07/03/2014  Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

06/25/2014  The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Subatmospheric gas storage and delivery: Past, present and future

06/19/2014  Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

200mm equipment market gaining new lease on life

06/16/2014  In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Crystal IS introduces Optan LED technology

06/12/2014  Crystal IS, a developer of high-performance ultraviolet (UVC) LEDs, this week announced availability of Optan.

Industry sustainability efforts mount with III-Vs and other advanced technologies

06/12/2014  The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

On the road to recovery: Semiconductor growth expected for the next two years

06/09/2014  According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

Dow Corning silicone wins Innovation Award at 2014 LIGHTFAIR International

06/05/2014  This marks the third time in two years that Dow Corning’s Moldable Silicone product technology has garnered top recognition during LIGHTFAIR International’s (LFI) annual awards.

Strengthening recovery: Fab equipment spending - 24% increase in 2014, possible record in 2015

06/04/2014  After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

Osamu Nakamura named President of SEMI Japan

06/03/2014  Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Samsung improves color rendering in its LED components

06/02/2014  Samsung Electronics today announced that it has improved the light quality of its LED packages and modules based on a 90 CRI (Color Rendering Index) for use in advanced lighting applications.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Wet Processing

July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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