10/19/2016 SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.
10/14/2016 Berkeley Lab and University of Colorado-Boulder team develop new way to reveal crystal features in functional materials.
10/14/2016 Less than a micrometre thin, bendable and giving all the colours that a regular LED display does, it still needs ten times less energy than a Kindle tablet. Researchers at Chalmers University of Technology have developed the basis for a new electronic "paper".
10/14/2016 LED remains the dominant sapphire application in 2016. Overall, rates of usage in smartwatches have been disappointing and have decreased below 2015 levels.
10/13/2016 SEMICON Europa 2016, opening in less than two weeks in Grenoble, will explore the issues facing Europe's semiconductor and electronics industries, including processes, materials, equipment and supply chain.
10/13/2016 Samsung Electronics Co., Ltd. today announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.
10/12/2016 Scientists with the Energy Department's National Renewable Energy Laboratory (NREL) for the first time discovered how to make perovskite solar cells out of quantum dots and used the new material to convert sunlight to electricity with 10.77 percent efficiency.
10/10/2016 Researchers have designed a device that uses light to manipulate its mechanical properties. The device, which was fabricated using a plasmomechanical metamaterial, operates through a unique mechanism that couples its optical and mechanical resonances, enabling it to oscillate indefinitely using energy absorbed from light.
10/05/2016 Due to increasing capacity from China, South Korean LCD panel makers are quickly realizing that LCD displays profitability may eventually erode, due to growing capacity and price competition from China, so they are betting their future on organic light-emitting diode (OLED) displays.
10/05/2016 Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Jin Jang of Kyung Hee University in Seoul, Korea, has joined the Technical Advisory Board (TAB).
09/29/2016 Dialog Semiconductor plc today announced the appointment of Mary Chan to the company's Board of Directors, effective December 1, 2016.
09/21/2016 Since the novel inkjet printing solution debuted in manufacturing in 2014, the company has secured the vast majority of available TFE orders.
09/21/2016 The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.
09/19/2016 As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.
09/14/2016 SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.
09/13/2016 SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts.
09/09/2016 "Promising" and "remarkable" are two words U.S. Department of Energy's Ames Laboratory scientist Javier Vela uses to describe recent research results on organolead mixed-halide perovskites.
09/08/2016 Expect 4% growth (YoY) for 2016 and 11% for 2017
09/07/2016 Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.
09/01/2016 “The sapphire industry is still plagued by overcapacity and rapid price declines,” asserts Yole Développement (Yole) in its latest report Sapphire Applications & Market 2016: LED & Consumer Electronics.
October 26, 2016 at 1 p.m. ET / Sponsored by Air Products
With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.