LEDs

LEDS ARTICLES



Sensor competition, actuator recovery impact supplier ranking

04/30/2015  Sensor leader Bosch grabs 20 percent of worldwide sales in 2014 while ST falls from second to fourth place with a 19 percent drop in dollar volume last year, says new O-S-D Report.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

04/30/2015  Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.

Global LCD TV panel shipments reached monthly record high in March 2015

04/28/2015  LCD TV panel shipments from global panel makers reached 23.9 million in March 2015, growing 20 percent month over month and 11 percent year over year.

C3nano seals acquisition of Asia's largest manufacturer of silver nanowire, Aiden Co. Ltd. Korea

04/28/2015  C3nano, Inc. announced today that it has acquired the major supplier of silver nanowire (AgNW) in Asia, Aiden Co. Ltd. of Korea.

LED phosphors market: Strong price pressure stalls revenue growth but masks a more complex picture

04/24/2015  While volumes are expected to more than double between 2015 and 2020, LED phosphor prices have declined dramatically, leading to a flat revenue outlook.

Brewer Science closer to zero-landfill status with "Big Blue" compactor that turns waste into electricity

04/21/2015  Brewer Science today announced its latest initiative to achieve and maintain zero-landfill status: a giant blue trash compactor that turns garbage into electricity.

SiVance, LLC opens R&D lab to drive innovations in specialty silane and silicone technologies

04/21/2015  SiVance, LLC, a subsidiary of Milliken & Company, today announced the opening of a new, 11,000 sq.ft. research and development (R&D) laboratory.

Global semiconductor market achieves strong, broad-based growth in 2014

04/20/2015  Highest annual growth rate since 2010; strong growth expected again in 2015.

MagnaChip to offer diversified products for Internet of Things applications

04/20/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

San'an licenses Japanese LED patent portfolio to Luminus Devices

04/16/2015  San'an Optoelectronics Co., Ltd. today announced that it has licensed the United States patents of an LED patent portfolio it recently acquired from a major Japanese company to its subsidiary, Luminus Devices, Inc.

Semiconductor CEOs urge congress to enact Trade Promotion Authority

04/16/2015  The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

ClassOne enters ECD lab partnership with Shanghai Sinyang

04/14/2015  Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.

Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwide

04/14/2015  April 2015 marks the 50th anniversary of one of the business world’'s most profound drivers, now commonly referred to as Moore's Law.

Sensor shipments strengthen but falling prices cut sales growth

04/10/2015  Sensor shipments are getting a big boost from the spread of embedded measurement functions for automated intelligent controls in systems and new high-volume applications, but sales growth is being pulled down significantly by price erosion in this once high-flying semiconductor marketplace.

2014: A year in review - Semiconductor equipment and materials market and outlook

04/09/2015  2014 was the second record breaking year in a row in terms of semiconductor device revenues; the industry grew a robust 10 percent to total $336 billion, according to the WSTS.

Techniques for simplifying pulsed measurements: Part 2

04/08/2015  Common pulsed measurement challenges are defined.

Flexible facilities for 450mm wafer fabs

04/07/2015  When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.

Web tension control in roll-to-roll web processing

04/07/2015  Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity.

SEMI reports 2014 global semiconductor materials sales of $44.3B

04/07/2015  The global semiconductor materials market increased 3 percent in 2014 compared to 2013 while worldwide semiconductor revenues increased 10 percent.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS



MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015