LEDs

LEDS ARTICLES



Flexible LEDs

09/24/2014  Flexible light-emitting diode (LED) displays and solar cells crafted with inorganic compound semiconductor micro-rods are moving one step closer to reality, thanks to graphene and the work of a team of researchers in Korea.

Pixelligent Technologies announces $1.25M solid-state lighting award from the Department of Energy

09/23/2014  Pixelligent Technologies announced today that it has been selected for a Department of Energy (DOE) solid-state-lighting award to support the continued development of its OLED lighting application.

In the LED packaging world, Flip Chip technology is rising

09/19/2014  In the LED packaging world, a wind of change is blowing. A LED TV crisis, and new Chinese players have totally modified the LED industry and its supply chain.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

09/18/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Making quantum dots glow brighter

09/18/2014  Ultrathin layers of metal oxides can change the way quantum dots behave, in some cases turning them into more efficient light emitters.

New research proves whiteness and color rendering has strong effect on LED lamp preference

09/18/2014  Soraa, a developer of GaN on GaN LED technology, announced today new psychophysical research proving that whiteness and color rendering have a strong effect on the perception of energy-efficient LED lighting.

Kateeva receives $38 million in financing

09/15/2014  Kateeva announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC).

Outlook: Healthy equipment spending into 2015

09/10/2014  The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Equipment spending shows strong growth for 2014 and 2015

09/10/2014  Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

09/10/2014  CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

A fundamental truth of process control

09/09/2014  You can’t fix what you can’t find. You can’t control what you can’t measure.

Intematix and SABIC collaborate to deliver increased efficiency solutions for LED systems

09/09/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, has collaborated with SABIC's Innovative Plastics business to create the ChromaLit Linear - a LED offering developed for the lighting industry.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

09/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

10nm success depends on concurrent design and development

09/08/2014  The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

Cree SiC MOSFETs help power Japan’s growing solar energy infrastructure

09/08/2014  Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

09/03/2014  Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

08/28/2014  SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

Seoul Semiconductor launches smart lighting Acrich LED Light Engine

08/28/2014  Seoul Semiconductor announced the release of a new LED light engine with Acrich 3 technology.

SemiLEDs launches EF FlipChip LED series

08/27/2014  SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.

Scientists craft a semiconductor only three atoms thick

08/27/2014  Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Advanced Packaging

Oct. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

Oct. 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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