LEDs

LEDS ARTICLES



SEMI launches new integrated packaging assembly and test group

02/10/2016  SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

Ultratech announces promotion of two executives

02/10/2016  Ultratech, Inc., a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high­brightness LEDs (HB­ LEDs), as well as atomic layer deposition (ALD) systems, announced the promotion of two of its executives.

Another record year for silicon wafer shipment volumes in 2015

02/10/2016  Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

58% of pure-play foundry capacity under high risk for seismic activity

02/09/2016  As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

Top LED company selects ClassOne's Solstice electroplater

02/09/2016  Semiconductor equipment manufacturer ClassOne Technology announced the purchase of its Solstice S8 electroplating system by one of the world's leading LED manufacturers.

Global semiconductor sales top $335B in 2015

02/01/2016  The Semiconductor Industry Association (SIA) today announced the global semiconductor industry posted sales totaling $335.2 billion in 2015, a slight decrease of 0.2 percent compared to the 2014 total, which was the industry's highest-ever sales total.

Foundries takeover 200mm fab capacity by 2018

02/01/2016  IoT drives worldwide 200mm fab capacity in 2018 back to 2006 levels.

Quantum dot market worth $4.6B by 2021

01/29/2016  The global value of quantum dot markets was $306 million USD in 2014 and is expected at $4.6 billion USD over the forecast period due to the subsequent generation device, display, and system activated by quantum dot.

Breakthrough enables ultra-fast transport of electrical charges in polymers

01/28/2016  A research team at Umeå University in Sweden has showed, for the first time, that a very efficient vertical charge transport in semiconducting polymers is possible by controlled chain and crystallite orientation.

Thin wafer market worth $9.17B by 2022

01/27/2016  According to a new marketsandmarkets report, the market was valued $6.76 Billion in 2015 and estimated to reach $9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022.

North American semiconductor equipment industry posts December 2015 book-to-bill ratio of 0.99

01/27/2016  A book-to-bill of 0.99 means that $99 worth of orders were received for every $100 of product billed for the month.

China semiconductor acquisitions surge; SEMICON China brings the new market into focus

01/26/2016  During SEMICON China 2016 on March 15-17 in Shanghai, key government decision makers, IC fund managers, and global industry analysts will share their insights on China's IC manufacturing policy.

SEMICON Korea opening: Memory and mobility drive IC manufacturing

01/26/2016  SEMICON Korea 2016 at COEX in Seoul opens tomorrow with more than 540 exhibiting companies and an expected 40,000 attendees.

Memristor Variants and Models from Knowm

01/22/2016  Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

Cornell-led team creates gallium nitride power diode

01/22/2016  Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing.

2016 Critical Materials Council (CMC) Seminar – Call for Papers

01/21/2016  The Critical Materials Council (CMC) and TECHCET have issued a call for papers to be presented at the “Critical Materials for Device Driven Scaling” Seminar to be held May 5-6, 2016 in Hillsboro, Oregon, USA.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Dialog Semiconductor declines to revise bid for Atmel

01/18/2016  UK-based chipmaker Dialog Semiconductor plc's board of directors has determined not to revise its proposal to acquire US-based microcontroller and touch solutions specialist Atmel Corp., the company said.

New LED with luminescent proteins

01/13/2016  Scientists from Germany and Spain have discovered a way to create a BioLED by packaging luminescent proteins in the form of rubber.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016