LEDs

LEDS ARTICLES



Ultratech receives multiple system, follow-on order for fan-out wafer-level packaging applications

06/28/2016  Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

SiC power business is a reality

06/27/2016  Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.

Automotive semiconductor market grows slightly in 2015 while ranks shift

06/22/2016  Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.

Samsung introduces new line-up of LED components for automotive lighting, featuring chip-scale packaging

06/21/2016  Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

Ultratech receives follow-on order from major Asian foundry for laser spike annealing system

06/21/2016  The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

Let there be light

06/17/2016  Utah engineer discovers light can stamp out defects in semiconductors for better solar panels and LED bulbs.

Ultratech enables world's lowest contact resistivity for finFETs with LXA melt laser annealing technology

06/16/2016  This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.

WPG Americas Inc. announces distribution agreement with Seoul Semiconductor

06/15/2016  WPG Americas Inc. announced today it has signed a new agreement with Seoul Semiconductor the world's fifth largest LED supplier to distribute their full complete line of products.

Day 2 at The ConFab 2016: Success in semiconductor growth and fab management

06/14/2016  During the Tuesday morning sessions, ConFab attendees heard from speakers from Mentor Graphics, Intel, Infineon Technologies, Quantum Clean, and Edwards.

Wide color gamut displays to comprise 17% of display shipment area in 2018

06/14/2016  Shipment area of wide color gamut (WCG) displays is expected to reach 32 million square meters in 2018, which represents 17 percent of total display shipment area.

Novel capping strategy improves stability of perovskite nanocrystals

06/14/2016  Study addresses instability issues with organometal-halide perovskites, a promising class of materials for solar cells, LEDs, and other applications.

Solid State Watch: June 3-9, 2016

06/10/2016  Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction in 2016 and 2017; Tiny lasers enable faster, less power-hungry next-gen microprocessors; IC Insights releases update to Market Drivers Report

The sapphire industry: What’s next?

06/10/2016  Almost two years after GTAT’s bankruptcy, the sapphire industry is still there. Its decor and characters have, of course, changed but the story is still unfolding.

Countdown to Node 5: Moving beyond FinFETs

06/10/2016  A forum of industry experts at SEMICON West 2016 will discuss the challenges associated with getting from node 10 -- which seems set for HVM -- to nodes 7 and 5.

Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

High Tech U in Taiwan for first time

06/07/2016  The SEMI High Tech U learning program commenced April 20-22 in Hsinchu, Taiwan.

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

06/06/2016  The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

06/05/2016  Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

06/05/2016  Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps

Solid State Watch: May 27-June 2, 2016

06/03/2016  GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive products; UT Dallas physicists research topological insulators




TWITTER


WEBCASTS



Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS