LEDs

LEDS ARTICLES



Wearables and bioelectronics seek better energy storage

09/01/2015  Energy storage players are eyeing emerging opportunities in bioelectronics as wearable, implantable and other medical devices create energy demands and design requirements beyond conventional batteries, according to Lux Research.

Tech, academic leaders call for robust research investments to bolster U.S. tech leadership, advance IoT

09/01/2015  A coalition of leaders from the tech industry and academia, led by the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), today released a report highlighting the urgent need for robust investments in research to advance the burgeoning Internet of Things (IoT) and develop other cutting-edge innovations that will sustain and strengthen America’s global technology leadership into the future.

Flexible 7 inch touch panel with integrated OLED display developed

09/01/2015  Together with ITRI, Taiwan, Heraeus, demonstrated the integration of Clevios conductive polymer based touch panel with AM OLED technology in a highly flexible device.

Solid State Watch: August 21-27, 2015

08/31/2015  New ams fab going to Marcy, NY: Startups and small electronics companies spent $78.3 billion on semiconductors in 2014; Pure-play foundry sales forecast to grow to all-time high in 4Q15; University of Colorado and SRC research accelerates microscopic imaging for next-generation nanoelectronics

RayVio announces expansion of UV LED manufacturing capacity

08/28/2015  RayVio Corporation, a developer of deep ultraviolet (UV) LEDs and integrated solutions, announced today that they are expanding their international sales force, and manufacturing capacity. The facility expansion at the original site is scheduled to be complete by year-end.

A partnership to secure and protect the emerging Internet of Things

08/28/2015  The National Science Foundation (NSF), in partnership with Intel Corporation, one of the world's leading technology companies, today announced two new grants totaling $6 million to research teams that will study solutions to address the security and privacy of cyber-physical systems.

Comfortable Consumer EEG Headset Shown by Imec and Holst Centre

08/27/2015  Medical-quality data acquisition of signals tracing emotions and moods.

Managing Dis-Aggregated Data for SiP Yield Ramp

08/24/2015  In general, there is an accelerating trend toward System-in-Package (SiP) chip designs including Package-On-Package (POP) and 3D/2.5D-stacks where complex mechanical forces—primarily driven by the many Coefficient of Thermal Expansion (CTE) mismatches within and between chips and packages—influence the electrical properties of ICs.

Book-to-bill ratio reports indicate a solid year for the industry

08/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

"Quantum dot" technology may help light the future

08/19/2015  Advances at Oregon State University in manufacturing technology for “quantum dots” may soon lead to a new generation of LED lighting that produces a more user-friendly white light, while using less toxic materials and low-cost manufacturing processes that take advantage of simple microwave heating.

SUSS MicroTec announces new competence-center for nanoimprint in North America

08/18/2015  SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field of nanoimprint technologies.

Demand for novel display materials set to surge in second half of 2015

08/17/2015  Starting in the second half of 2015, the overall consumption of active-matrix organic light-emitting diode (AMOLED) materials will surge, as LG Display increases the production of white organic light-emitting diode (WOLED) TV panels

Imec pushes the boundaries of GaN technology

08/12/2015  Nano-electronics research center imec announced today that it is extending its Gallium Nitride-on-Silicon (GaN-on-Si) R&D program, and is now offering joint research on GaN-on-Si 200mm epitaxy and enhancement mode device technology.

Record shipments levels continue into the second quarter 2015

08/11/2015  Worldwide silicon wafer area shipments increased during the second quarter 2015 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

08/11/2015  Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

MagnaChip to host first Foundry Technology Symposium in Shanghai, China

08/10/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today it is hosting its first Foundry Technology Symposium at the Grand Hyatt in Shanghai, China, on September 22, 2015.

New research may enhance display & LED lighting technology

08/10/2015  Researchers from the University of Illinois at Urbana-Champaign have produced some promising results toward that goal, developing a new method to extract more efficient and polarized light from quantum dots (QDs) over a large-scale area.

Samsung cuts Intel's semiconductor sales lead to 16% in second quarter

08/06/2015  Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

Intel to collaborate with Georgia Tech

08/05/2015  Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

MEMS Industry Group Conference Asia explores MEMS and sensors opportunities in global IoT

08/04/2015  MEMS Industry Group (MIG) will gather the world’s leading providers of micro-electromechanical systems (MEMS) and sensors technology for its second annual MEMS Industry Group Conference Asia in Shanghai, China on September 8-11, 2015.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015