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Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Cree, Inc. announces long-term silicon carbide wafer supply agreement with Infineon

02/26/2018  Cree, Inc. announces that it signed a strategic long-term agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to Infineon Technologies AG.

Smart lighting market to grow at 21.50% CAGR to 2023

02/23/2018  ReportsnReports.com adds Smart Lighting Market is forecast to reach $20.98 billion by 2023 from $7.93 billion in 2018 at a CAGR of 21.50% during (2018-2023) driven by the modernization and development of infrastructure to transform cities into smart cities, need for energy-efficient lighting systems, increasing adoption and decreasing cost of LEDs, increased demand for intelligent solutions for street lighting systems, and growing awareness about energy savings among consumers and governments worldwide.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Samsung Display and Universal Display Corporation enter into long-term OLED agreements

02/15/2018  Universal Display Corporation today announced the signing of long-term OLED material supply and license agreements with Samsung Display Co., Ltd., a global display manufacturer.

Seoul Semiconductor files third patent infringement litigation against Mouser for sale of Everlight products in Italy

02/09/2018  According to the complaint, Seoul has asserted that Mouser is liable for selling such LED products that infringe Seoul's patent rights. Based on the alleged infringement, Seoul has sought a permanent injunction, damages, withdrawal from the market, and destruction of such products.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

MicroLED displays: the patent landscape reflects the dynamism of the sector

01/31/2018  This year again, the Las Vegas Consumer Electronics Show, 2018 edition allowed us to discover the latest innovations in numerous fields including the microLED displays sector.

A crystal method

01/31/2018  UCSB researchers unlock another piece of the puzzle that is crystal growth.

Seoul Semiconductor achieves $1.04B record annual revenues for fiscal year 2017

01/30/2018  The 16% rise in consolidated revenues far exceeds the industry average, which grew 2% during the same period.

Kateeva appoints Marc Haugen as Chief Operating Officer

01/30/2018  Kateeva, a developer of inkjet deposition equipment solutions for OLED display manufacturing, today announced that the company has expanded its executive team by appointing Marc Haugen as chief operating officer (COO).

Sino IP office rules in favor of AMEC by rendering Veeco Instruments' susceptorless reactor patent invalid

01/29/2018  Advanced Micro-Fabrication Equipment Inc. today announced that the Patent Re-examination Board (PRB) of the State Intellectual Property Office (SIPO) in China, ruled on Jan. 23 that all patent claims relating to patent number ZL 01822507.1 held by Veeco Instruments Inc. are invalid.

Turbulent times ahead for trade

01/25/2018  International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.

Scientists reveal the fundamental limitation in the key material for solid-state lighting

01/24/2018  For the first time an international research group has revealed the core mechanism that limits the indium (In) content in indium gallium nitride ((In, Ga)N) thin films - the key material for blue light emitting diodes (LED).

Value of semiconductor industry M&A deals slows dramatically in 2017

01/18/2018  Numerous smaller deals were made but "megadeals" were scarce last year.

2018 will see first uses of 8K resolution display

01/16/2018  As the demand for super-large TV displays grow, the need for higher resolution is set to increase, seeing the first uses of 8K display in 2018, according to IHS Markit.

Researchers propose new gas-solid reaction for high-speed perovskite photodetector

01/16/2018  The gas-solid reaction method provides a full coverage of the perovskite film and avoids the damage from the organic solvent, which is beneficial for the light capture and electrons transportation, resulting in a faster response time and stability for the perovskite photodetector.

Expanded SiC Schottky diode line from Littelfuse reduces switching losses, increases efficiency and robustness

01/16/2018  Littelfuse, Inc. today introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family, which was originally released in May 2017.

Extremely bright and fast light emission

01/11/2018  An international team of researchers from ETH Zurich, IBM Research Zurich, Empa and four American research institutions have found the explanation for why a class of nanocrystals that has been intensively studied in recent years shines in such incredibly bright colours.




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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

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Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

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Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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