LEDs

LEDS ARTICLES



Cambridge Nanotherm appoints Ewald Braith as Non-Exec Director

02/06/2015  Cambridge Nanotherm today announced that Ewald Braith has joined the board as a Non-Exec Director.

Quantum Materials begins shipping cadmium-free red and green quantum dots

02/05/2015  Rapidly growing North American quantum dot manufacturer Quantum Materials Corp today announced it has begun shipping Cadmium-free red and green quantum dots in evaluation and production quantities to select consumer electronics manufacturers.

Fairchild simplifies dimmable LED lighting design

02/04/2015  Fairchild, a global supplier of high-performance power semiconductor solutions, today announced the FL7734 Phase-Cut Dimmable Single- Stage LED Driver.

SEMICON Show Highlights Chip Manufacturing in South Korea

02/04/2015  The SEMICON Korea conference and exhibition opens Wednesday in Seoul for a three-day run. The show highlights the importance of semiconductor manufacturing in South Korea, home to two of the biggest memory chip makers in the world, Samsung Electronics and SK Hynix.

SEMICON Korea opens tomorrow: Korea IC manufacturing fueled by memory and mobility

02/03/2015  SEMICON Korea 2015 at COEX in Seoul opens tomorrow with more than 500 exhibiting companies and an expected 40,000 attendees.

Global semiconductor industry posts record sales in 2014

02/02/2015  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the global semiconductor industry posted record sales totaling $335.8 billion in 2014, an increase of 9.9 percent from the 2013 total of $305.6 billion.

ClassOne acquires Microprocess Technologies product lines

02/02/2015  ClassOne Technology, the wet-chemistry semiconductor equipment manufacturer, has announced the acquisition of two complete product lines from Microprocess Technologies.

New method allows for greater variation in band gap tunability

01/30/2015  If you can't find the ideal material, then design a new one.

Demystifying nanocrystal solar cells

01/30/2015  Scientists are focusing on nanometer-sized crystals for the next generation of solar cells. These nanocrystals have excellent optical properties. Compared with silicon in today's solar cells, nanocrystals can be designed to absorb a larger fraction of the solar light spectrum. However, the development of nanocrystal-based solar cells is challenging.

Crystal light: New light-converting materials point to cheaper, more efficient solar power

01/30/2015  University of Toronto engineers study first single crystal perovskites for new applications Engineers have shone new light on an emerging family of solar-absorbing materials that could clear the way for cheaper and more efficient solar panels and LEDs.

Flat panel display area demand growing rapidly

01/29/2015  Increasing sizes of display panels for TVs, smartphones, mobile PCs and automotive displays are driving increases in total flat-panel-display area demand growth.

New MES operations improvement software from critical manufacturing features integrated scheduling

01/28/2015  Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling.

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

01/28/2015  Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the issue of improving communications between the Old World and the New World.

North American semiconductor equipment industry posts December 2014 book-to-bill ratio of 0.98

01/26/2015  North America-based manufacturers of semiconductor equipment posted $1.37 billion in orders worldwide in December 2014 (three-month average basis) and a book-to-bill ratio of 0.98, according to the December EMDS Book-to-Bill Report published today by SEMI.

Self-assembled nanotextures create antireflective surface on silicon solar cells

01/23/2015  Scientists at the U.S. Department of Energy's Brookhaven National Laboratory show that etching a nanoscale texture onto the silicon material itself creates an antireflective surface that works as well as state-of-the-art thin-film multilayer coatings.

Scientists 'bend' elastic waves with new metamaterials that could have commercial applications

01/23/2015  Engineering researchers at the University of Missouri have developed a material that has the ability to control these waves, creating possible medical, military and commercial applications with the potential to greatly benefit society.

Will new policy in China trigger big changes?

01/21/2015  In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

Ten lighting and LED trends to watch in 2015

01/20/2015  The recent restructuring by major global lighting companies will allow LED makers to raise capital for investments in 2015.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Solving an organic semiconductor mystery

01/16/2015  Berkeley Lab researchers uncover hidden structures in domain interfaces that hamper performance.




FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015