08/31/2016 The global market for gallium nitride (GaN) semiconductor devices is largely consolidated, with the top four companies commanding a share of over 65% of the overall market in 2015, states Transparency Market Research (TMR) in a new report.
08/30/2016 Texas Instruments (TI) recently entered into an agreement with Silicon Catalyst, a Silicon Valley-based incubator, that will expand TI's access to new technology innovations and potentially lead to engagements with semiconductor startups focused on creating chips and system solutions in analog and embedded processing.
08/30/2016 TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report
08/26/2016 Samsung Electronics Co., Ltd. today announced “H-series Gen 3,” a new line-up of LED linear modules that features high efficacy and enables easy replacement of fluorescent lights with LED lamps.
08/25/2016 In a short term, UV curing will drive the UV LED market, announces Yole Développement (Yole) in its new LED report entitled UV LEDs: Technology, Manufacturing and Applications Trends.
08/25/2016 A powerful new material developed by Northwestern University chemist William Dichtel and his research team could one day speed up the charging process of electric cars and help increase their driving range.
08/24/2016 North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July 2016 (three-month average basis) and a book-to-bill ratio of 1.05.
08/18/2016 IHS Markit released its annual 2015 revenue-share ranking of the top LED suppliers in backlighting, automotive, lighting and other applications.
08/18/2016 Toshiba America Electronic Components, Inc. today announced a new lineup of ultra-efficient, high-speed, high-voltage MOSFETs for switching voltage regulator designs.
08/16/2016 Problems frequently arise as a result of an incomplete or absent formal risk assessment when processes are modified or new materials introduced.
08/15/2016 Pixelligent Technologies, a developer of high-index advanced materials for solid state lighting and display applications and producer of PixClear products, announced today that it closed $10.4 million in new funding.
08/12/2016 Veeco Instruments Inc. announced today that Epistar Corporation has ordered multiple TurboDisc EPIK 700 GaN MOCVD Systems for the production of LEDs.
08/11/2016 SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.
08/10/2016 Metal-organic frameworks with a piggyback structure open up new possibilities for solar cells and LEDs -- publication in the Advanced Materials scientific journal.
08/09/2016 New molecules promise cheaper, more efficient OLED displays.
08/03/2016 Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).
08/02/2016 ams AG has launched the smallest ever optical sensor module that delivers a combination of colour (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.
08/02/2016 The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.
08/02/2016 Ultratech, Inc. today announced that it has received an 'Outstanding Supplier Award' from SJ Semiconductor Corp.
07/29/2016 Researchers at the University of Illinois at Urbana Champaign have developed a new method for making brighter and more efficient green light-emitting diodes.
October 26, 2016 at 1 p.m. ET / Sponsored by Air Products
With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.