LEDs

LEDS ARTICLES



AMEC wins injunction in patent infringement dispute with Veeco

12/11/2017  The injunction prohibits Veeco Shanghai from importing, manufacturing, selling or offering for sale to any third party any MOCVD systems and wafer carriers used in the MOCVD systems that would infringe AMEC’s patent CN 202492576 in China.

Cree launches industry's first extreme density LED

12/07/2017  The XLamp XD16 LED delivers a lumen density of more than 284 lumens per square-millimeter, which is the highest level achieved by a commercially available lighting-class LED.

How to tame the electromagnetic interference in the fabs and beyond

12/07/2017  Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.

Global semiconductor sales increase 21.9% year-to-year in October

12/05/2017  October marked the global industry's largest-ever monthly sales total.

TI's new automotive LED lighting controller puts the power in designers' hands

12/01/2017  Texas Instruments introduced the first 3-channel high-side linear automotive light-emitting diode (LED) controller without internal MOSFETs which gives designers greater flexibility for their lighting designs.

Atomistic calculations predict that boron incorporation increases the efficiency of LEDs

11/29/2017  Using predictive atomistic calculations and high-performance supercomputers at the NERSC computing facility, researchers Logan Williams and Emmanouil Kioupakis at the University of Michigan found that incorporating the element boron into the widely used InGaN (indium-gallium nitride) material can keep electrons from becoming too crowded in LEDs, making the material more efficient at producing light.

Transphorm secures investment from Yaskawa Electric

11/29/2017  Transphorm Inc. announced it received a $15 million investment from Yaskawa Electric Corporation.

Kateeva introduces the YIELDjet EXPLORE product family for OLED RGB pixel deposition

11/28/2017  Suite of inkjet deposition systems to enable R&D and pilot production of large-size OLED displays

Kateeva names Dr. Homer Antoniadis as Executive Vice President of Technology

11/17/2017  Kateeva, a developer of OLED production equipment solutions, today appointed Dr. Homer Antoniadis to the newly created role of Executive Vice President of Technology.

TEL NEXX modernizes shop floor data collection and quality control with InfinityQS ProFicient

11/16/2017  Quality Intelligence solution enables chip metallization provider to improve accuracy and timeliness of data capture, rapidly respond to issues, and identify opportunities for continuous improvement.

Flexible AMOLED panel supply capacity to exceed demand by 44% in 2018

11/16/2017  With flexible active-matrix organic light-emitting diode (AMOLED) panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44 percent higher than global demand in 2018, according to IHS Markit.

The stacked color sensor

11/16/2017  True colors meet minimization.

Seoul Semiconductor introduces an Acrich-based compact LED lriver with 5X the power density of conventional drivers

11/15/2017  Seoul Semiconductor has developed an ultra-compact LED driver series with a power density 5X higher than conventional LED drivers.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

The next generation of power electronics? Gallium nitride doped with beryllium

11/10/2017  How to cut down energy loss in power electronics? The right kind of doping.

Tech increases microfluidic research data output 100-fold

11/09/2017  Researchers have developed a technique that allows users to collect 100 times more spectrographic information per day from microfluidic devices, as compared to the previous industry standard. The novel technology has already led to a new discovery: the speed of mixing ingredients for quantum dots used in LEDs changes the color of light they emit - even when all other variables are identical.

Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

Pixelligent Technologies appoints Alain Harrus and Gene Banucci to its Board of Directors

11/07/2017  Pixelligent Technologies announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

MagnaChip offers 0.35 micron 700V ultra-high voltage process technology with process simplification

11/06/2017  MagnaChip Semiconductor Corporation announced today it now offers a 0.35 micron 700V Ultra-High Voltage process technology (UHV) that reduces mask counts, manufacturing time and cost for power-related AC-DC products.

Costs of 55-inch OLED TV display production catch up to LCD TV panels

11/03/2017  Unit cost for 55-inch UHD OLED TV panels recorded a 55 percent decline in second quarter of 2017 since its introduction in early 2015.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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