LEDs

LEDS ARTICLES



Thailand's semiconductor sector on-track to tap $280B global automotive electronics industry

03/09/2016  SEMICON SEA 2016 to feature Thailand specific forums and discussions.

IoT Planet to co-locate with SEMICON Europa in 2016

03/09/2016  IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.

GLOBALFOUNDRIES adds Alain Mutricy as head of Product Management Group

03/04/2016  Mutricy succeeds Mike Cadigan, who will transition to a newly created role as senior vice president of global sales and business development.

Many Mixes to Match Litho Apps

03/03/2016  "Mix and Match" has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing.

Gartner identifies the top 10 Internet of Things technologies for 2017 and 2018

03/03/2016  Gartner, Inc. has highlighted the top 10 Internet of Things (IoT) technologies that should be on every organization's radar through the next two years.

Inventory adjustments causing TV and IT display shipments to decline in Q1 2016

03/02/2016  LCD manufacturer inventory adjustments and continued slowing demand are causing TV and IT display prices to fall, further eroding panel makers’ profitability.

ON Semiconductor and RFMicron to unveil IoT platform

03/01/2016  ON Semiconductor Corporation has teamed up with RFMicron, Inc. to unveil multifaceted Internet of Things, or IoT, sensor platform supporting battery-free operation.

Lifetime breakthrough promising for low-cost and efficient OLED displays and lights

03/01/2016  Researchers increased the device lifetime of OLEDs that use a recently developed class of molecules to convert electricity into light.

Artificial control of exciplexes opens possibilities for new electronics

02/26/2016  Researchers at Kyushu University were able to widely vary the emission color and efficiency of OLEDs.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

Physicists promise a copper revolution in nanophotonics

02/25/2016  Researchers from the Moscow Institute of Physics and Technology (MIPT) have for the first time experimentally demonstrated that copper nanophotonic components can operate successfully in photonic devices.

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

Applied Materials' Robert Visser honored by Society of Information Display

02/24/2016  Applied Materials, Inc. today announced that Dr. Robert Visser has received a 2016 Special Recognition Award from the Society of Information Display.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

Organic light-emitting materials used to produce OLED panels grew 12% in 2015

02/18/2016  Shipments of organic light-emitting materials used to produce organic light-emitting diode (OLED) displays grew 12 percent year over year in 2015, reaching 26,000 tons, according to IHS.

GaN power devices market worth $2.60B by 2022

02/18/2016  A new report from MarketsandMarkets analyzes the GaN power device market and key industry players.

Veeco launches new K475i As/P MOCVD system

02/18/2016  Veeco Instruments Inc. announced today the launch of the new TurboDisc K475i Arsenic Phosphide MOCVD System for the production of red, orange, yellow light emitting diodes.

LED Taiwan 2016 to kick off in Taipei in April

02/17/2016  LED Taiwan will be held at TWTC Nangang Exhibition Hall in Taipei on April 13-16.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
MEMS: Current Status and Future Directions

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

In 2015, the MEMS market did not grow as much as we initially expected. In the past, the Smart Phone industry was a strong driver of the MEMS industry with ever increasing volume. Today, MEMS are becoming commodity products with very low price. The webcast will review the latest market data and forecasts for the future. The MEMS “commoditization” paradox will be discussed as well as latest technical trends (sensors combos, packaging).

Sponsored By:
Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS