LEDs

LEDS ARTICLES



MicroLEDs for displays: How we can make it happen

03/22/2017  Many large companies and startups are currently working on microLED technologies for display applications: from LED makers such as Epistar, Nichia or Osram to display makers like AUO, BOE or CSOT and OEMs such as Apple or Facebook/Oculus.

SEMI headquarters relocates

03/20/2017  SEMI today announced that it has moved its headquarters office to Milpitas, Calif.

The repulsion trick: A self-solving puzzle for organic molecules

03/16/2017  Jülich researchers have succeeded in controlling the growth of organic molecules using a special trick.

The ConFab 2017 announces leading semiconductor industry keynotes

03/14/2017  The ConFab announces keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

New material helps record data with light

03/09/2017  Russian physicists, with their colleagues from Europe through changing the light parameters, learned to generate quasiparticles - excitons, which were fully controllable and also helped to record information at room temperature.

Kateeva expands Silicon Valley headquarters

03/08/2017  The company has leased an adjacent building at its Newark campus, adding 75,000 sq. ft. that is zoned for manufacturing and business operations.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

Group blazes path to efficient, eco-friendly deep-ultraviolet LED

03/03/2017  A Cornell-led group has demonstrated the ability to produce deep-ultraviolet emission using an LED light source, potentially solving several problems related to quantum efficiency of current devices.

Seoul Semiconductor Europe introduces reference modules for its Wicop LEDs

03/02/2017  Seoul Semiconductor Europe, a subsidiary of Seoul Semiconductor Co. Ltd. today announced the availability of reference modules based on its package-free Wicop LEDs.

A SOI wafer is a suitable substrate for gallium nitride crystals

03/02/2017  Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth.

Dow Corning further expands design freedoms for LED packaging with five new optical silicone encapsulants

03/01/2017  Dow Corning further expanded the design flexibilities for LED packaging manufacturers today with the addition of five new optical encapsulants (OEs) to its portfolio of advanced LED solutions.

Versum Materials expands manufacturing capacity

03/01/2017  Versum Materials, Inc. announced today that it would expand its manufacturing capacity at its Delivery Systems and Service (DS&S) headquarters in Allentown, Pennsylvania.

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

LG Innotek unveils the world's first 70mW UV-C LED

02/23/2017  LG Innotek today announced that the company has developed the world's first 70mw UV-C LED for sterilization applications.

Mergers & acquisitions in 2017

02/19/2017  At SEMI's Industry Strategy Syposium this year, a merger's and acquisitions panel, moderated by Robert Maire of Semiconductor Advisors, took a look at how the industry might look in the future.

Vital Control in Fab Materials Supply-Chains - Part 2

02/16/2017  Expert panel discussion at Critical Materials Council (CMC) Conference

Ultratech receives large, repeat multiple system order for fan-out wafer-level packaging applications

02/16/2017  Ultratech, Inc. today announced that it has received a repeat, multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

Seoul Semiconductor starts mass production of its patented filament LEDs

02/15/2017  Seoul Semiconductor announced the immediate start of the mass production of its LED chip-on-board package for use in LED filament bulbs, a market currently estimated to be $1.3 billion globally.

Is a stretchable smart tablet in our future?

02/15/2017  Engineering researchers at Michigan State University have developed the first stretchable integrated circuit that is made entirely using an inkjet printer, raising the possibility of inexpensive mass production of smart fabric.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS