Flexible AMOLED panel supply capacity to exceed demand by 44% in 2018

11/16/2017  With flexible active-matrix organic light-emitting diode (AMOLED) panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44 percent higher than global demand in 2018, according to IHS Markit.

The stacked color sensor

11/16/2017  True colors meet minimization.

Seoul Semiconductor introduces an Acrich-based compact LED lriver with 5X the power density of conventional drivers

11/15/2017  Seoul Semiconductor has developed an ultra-compact LED driver series with a power density 5X higher than conventional LED drivers.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

The next generation of power electronics? Gallium nitride doped with beryllium

11/10/2017  How to cut down energy loss in power electronics? The right kind of doping.

Tech increases microfluidic research data output 100-fold

11/09/2017  Researchers have developed a technique that allows users to collect 100 times more spectrographic information per day from microfluidic devices, as compared to the previous industry standard. The novel technology has already led to a new discovery: the speed of mixing ingredients for quantum dots used in LEDs changes the color of light they emit - even when all other variables are identical.

Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

Pixelligent Technologies appoints Alain Harrus and Gene Banucci to its Board of Directors

11/07/2017  Pixelligent Technologies announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

MagnaChip offers 0.35 micron 700V ultra-high voltage process technology with process simplification

11/06/2017  MagnaChip Semiconductor Corporation announced today it now offers a 0.35 micron 700V Ultra-High Voltage process technology (UHV) that reduces mask counts, manufacturing time and cost for power-related AC-DC products.

Costs of 55-inch OLED TV display production catch up to LCD TV panels

11/03/2017  Unit cost for 55-inch UHD OLED TV panels recorded a 55 percent decline in second quarter of 2017 since its introduction in early 2015.

Veeco and ALLOS demonstrate 200mm GaN-on-Si performance to enable micro-LED adoption

11/01/2017  Veeco Instruments Inc. (Nasdaq: VECO) announced today the completion of a strategic initiative with ALLOS Semiconductors (ALLOS) to demonstrate 200mm GaN-on-Si wafers for Blue/Green micro-LED production.

Optoelectronics, sensors/actuators and discretes climb

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

Global AMOLED panel production capacity set to more than quadruple over next five years

10/27/2017  Samsung Display and LG Display to remain as market leaders.

Power GaN: Everything is in place for volume production

10/25/2017  Yole projects the explosion of the market with 84% CAGR between 2017 and 2022. The market value will so reach US$ 450 million at the end of the period.

Seoul Semiconductor's Horticultural Series LEDs deliver entire spectrum from UV-C to far-red

10/24/2017  The newly-introduced Horticultural Series LEDs from Seoul Semiconductor represent the only LED manufacturer to provide the entire spectrum of solid state lighting sources for the efficient growth and propagation of plants.

Researchers bring optical communication onto silicon chips

10/23/2017  Ultrathin films of a semiconductor that emits and detects light can be stacked on top of silicon wafers.

NRL clarifies valley polarization for electronic and optoelectronic technologies

10/20/2017  Many of today's technologies, such as, solid-state lighting, transistors in computer chips, and batteries in cell phones rely simply on the charge of the electron and how it moves through the material. In certain materials, such as the monolayer transition metal dichalcogenides (TMDs), electrons can be selectively placed into a chosen electronic valley using optical excitation.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

SEMICON Europa 2017: Keynotes announced

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

China IC industry outlook

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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San Jose, CA
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

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