07/21/2016 Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.
07/19/2016 The gallium nitride (GaN) substrates market is set to cross $4 billion USD by 2020, according to the market research report from IndustryARC.
07/18/2016 Silicon Valley specialty semiconductor foundry Noel Technologies, a provider of process development and substrate fabrication for a variety of high-technology industries, celebrates its 20th anniversary this month.
07/15/2016 A collaboration of researchers from Kumamoto, Yamaguchi, and Osaka Universities in Japan have discovered a new method of drastically changing the color and fluorescence of a particular compound using only oxygen (O2) and hydrogen (H2) gases.
07/13/2016 Kateeva is out to change the way displays are being made, and during Tuesday’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.
07/13/2016 Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.
07/13/2016 Gear up for Day 2 of SEMICON West with this list of must-see conference events.
07/13/2016 Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.
07/12/2016 The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.
06/28/2016 Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.
06/27/2016 Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.
06/22/2016 Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.
06/21/2016 Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.
06/21/2016 The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.
06/17/2016 Utah engineer discovers light can stamp out defects in semiconductors for better solar panels and LED bulbs.
06/16/2016 This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.
06/15/2016 WPG Americas Inc. announced today it has signed a new agreement with Seoul Semiconductor the world's fifth largest LED supplier to distribute their full complete line of products.
06/14/2016 During the Tuesday morning sessions, ConFab attendees heard from speakers from Mentor Graphics, Intel, Infineon Technologies, Quantum Clean, and Edwards.
06/14/2016 Shipment area of wide color gamut (WCG) displays is expected to reach 32 million square meters in 2018, which represents 17 percent of total display shipment area.
06/14/2016 Study addresses instability issues with organometal-halide perovskites, a promising class of materials for solar cells, LEDs, and other applications.
October 26, 2016 at 1 p.m. ET / Sponsored by Air Products
With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.
November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics
Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.