LEDs

LEDS ARTICLES



Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system

12/10/2013  SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

Research Alert: Dec. 10, 2013

12/10/2013  Thin, flexible solar cells; Polymers can be semimetals; MOF materials

The Week in Review: Dec. 6, 2013

12/06/2013  Worldwide semiconductor sales; Soitec announces high-volume manufacturing of eSI substrates; SEMI releases World Fab Forecast; Micron announces new VP of Quality; Industry on track for highest-ever annual sales in 2013

Nikkiso initiates shipments of deep ultraviolet LEDs

12/05/2013  NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.

RF-SOI Wafers for Wireless Applications

12/05/2013  The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.

FinFET on SOI: Potential Becomes Reality

12/05/2013  We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.

Lynk Labs grows patent portfolio for AC-LED technology

12/04/2013  Lynk Labs Inc., a AC LED technology company from circuits to systems has been granted another key patent by the US Patent Office. The patent covers vertical market segments of AC LED technology from the core AC LED circuits and powering methods to the lighting system level.

Research Alert: Dec. 3, 2013

12/03/2013  Imec integrates CCD and CMOS technology; New thermoelectronic generator; Nanoscale coating improves stability and efficiency of devices for renewable fuel generation

Lab school brings manufacturing technologies to middle-school classrooms

12/03/2013  A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

EV Group introduces full-field UV nanoimprint lithography system

12/03/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 720 automated UV nanoimprint lithography (UV-NIL) system.

Blog Review: December 2, 2013

12/02/2013  New blogs examine packaging news from Semicon Taiwan, how dynamic resource allocation during post-tapeout flow can increase turnaround time, the role of hardware in sensor fusion, and the Internet’s progress since its birth 44 years ago.

Advances in Post-Tape Out Resource Management

11/25/2013  Foundries, both pure-play and independent device manufacturers (IDM), rigorously compete for market share. One factor that helps them get and keep business is turnaround time (TAT). As technology nodes advance, achieving targeted production runtimes in the post-tapeout flow gets ever more challenging.

Blog Review: November 25, 2013

11/25/2013  New blogs examine Intel’s expanded push into the foundry business, the status of EUV sources, substrates for 3D integration, IEDM sessions, and the challenges of giga-scale circuit design with nano-scale technologies.

Eliminating the Challenges of Giga-Scale Circuit Design With Nano-Scale Technologies

11/25/2013  Dr. Lianfeng Yang of ProPlus Design Solutions, Inc. says that the only way out of today's challenges is to more tightly integrate tools for nano-scale modeling, giga-scale SPICE simulation and DFY.

The Week in Review: Nov. 22, 2013

11/22/2013  SoC solution on a 2.5D silicon interposer exhibited; SEMI reports October 2013 book-to-bill ratio above parity; Soraa to open new semi fab in NY; Dow Corning introduces new silicone for LEDs; SUSS installs excimer laser; EVG introduces non-contact lithography system

GLOBALFOUNDRIES, Open-Silicon and Amkor demo 2.5D test vehicle

11/22/2013  GLOBALFOUNDRIES, Open-Silicon and Amkor Technology have jointly exhibited a functional system-on-chip (SoC) solution on a 2.5D silicon interposer featuring two 28nm logic chips, with embedded ARM processors.

Rubicon Technology appoints Warren Stewart as Senior VP of Sales and Marketing

11/21/2013  Rubicon Technology, Inc. today announced that Warren S. Stewart III has joined the Company as Senior Vice President of Sales and Marketing, effective immediately.

Dow Corning newest moldable optical silicone expands options for more reliable LEDs

11/19/2013  Dow Corning introduced new Dow Corning MS-2002 Moldable White Reflector Silicone here at Strategies in Light Europe 2013.

EV Group introduces non-contact lithography system

11/19/2013  Leveraging EVG's expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.

Seoul Semiconductor introduces next generation of high power LEDs

11/18/2013  The improved efficacy helps lighting manufacturers use fewer LEDs in their system designs which translate to lower system costs.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014