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LEDS ARTICLES



New funding fuels ClassOne Technology's 2016 growth surge

04/12/2016  ClassOne Technology, manufacturer of cost-efficient Solstice electroplating systems, has announced the completion of a major new round of funding from Salem Investment Partners of Winston-Salem, North Carolina.

Presto Engineering and Peraso Technologies Develop Innovative Test Solution for 60 GHz Transceiver

04/12/2016  Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, today jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.

Cadence to Acquire Rocketick

04/11/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd.

Mentor Graphics U2U Meeting April 26 in Santa Clara

04/11/2016  Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.

The future is here: Interactive screens on your packages

04/08/2016  Instead of reading a label, consumers could be interacting with an electronic screen on packaging in the future, thanks to a revolutionary new development by scientists at the University of Sheffield.

Quantum dots enhance light-to-current conversion in layered semiconductors

04/08/2016  Harnessing the power of the sun and creating light-harvesting or light-sensing devices requires a material that both absorbs light efficiently and converts the energy to highly mobile electrical current.

Crumpling approach enhances photodetectors' light responsivity

04/07/2016  Researchers from the University of Illinois at Urbana-Champaign have demonstrated a new approach to modifying the light absorption and stretchability of atomically thin two-dimensional (2D) materials by surface topographic engineering using only mechanical strain.

Cadence and University of Oxford Foster the Advancement of Formal Verification Innovation

04/07/2016  Cadence Design Systems, Inc. and the University of Oxford today announced a move to foster the advancement of formal verification innovation with the appointment of Dr. Ziyad Hanna, Cadence vice president of R&D, as a visiting professor in Oxford's Department of Computer Science for the next three years.

SIA's VP of Global Policy to address China's new role in the semiconductor industry at The ConFab 2016

04/06/2016  Solid State Technology is pleased to announced that Jimmy Goodrich of the Semiconductor Industry Association is the latest distinguished guest confirmed to speak at The ConFab 2016.

Becoming crystal clear

04/06/2016  UCSB researchers identify specific defects in LED diodes that lead to less efficient solid state lighting.

Synopsys Debuts Tools at Users Group Meeting

03/30/2016  Aart de Geus, the chairman and co-chief executive officer of Synopsys, used his keynote address at the 2016 Synopsys Users Group conference in Silicon Valley to tout a pair of new products.

Samsung and Daintree partner to advance smart building IoT

03/24/2016  Samsung Electronics Co. and Daintree Networks said they are collaborating on joint solutions involving Samsung's smart lighting module (SLM).

Pivotal Critical Materials Conference for semiconductor fabs to take place May 5-6, 2016

03/23/2016  The Critical Materials Conference, a pivotal, 2-day event organized by TECHCET with the support of the Critical Materials Council, will be held this year in Hillsboro, Oregon on May 5th and 6th, directly following the Council Meeting.

The United States leads growing global industrial semiconductor market

03/22/2016  The industrial semiconductor market will post an 8 percent compound annual growth rate (CAGR), as revenue rises from $43.5 billion in 2014 to $59.5 billion in 2019.

3D Chips, New Packaging Challenge Metrology and Inspection Gear

03/21/2016  Metrology and inspection technology is growing more complicated as device dimensions continue to shrink. Discussing crucial trends in the field are Lior Engel, vice president of the Imaging and Process Control Group at Applied Materials, and Rudolph Technologies.

Molecular Modeling of Materials Defects for Yield Recovery

03/21/2016  New materials are being integrated into High Volume Manufacturing (HVM) of semiconductor ICs, while old materials are being extended with more stringent specifications.

Mentor Graphics Enhances Support for TSMC 7nm Design Starts and 10nm Production

03/17/2016  Mentor Graphics Corporation today announced further enhancements and optimizations to the Calibre® platform and Analog FastSPICE™ (AFS) platform by completing TSMC 10nm FinFET V1.0 certification.

New research shows how nanowires can be formed

03/17/2016  Researchers learning to control the properties of materials this way can lead the way to more efficient electronic devices.

Linde Supports New Wave of PV Plants in SE Asia

03/17/2016  The Linde Group supports the expansion of photovoltaic solar cell manufacturing in Southeast Asia by offering its full portfolio of gases and wet chemicals, along with engineering services, to help the new PV cell plants being established in the region.

New MEMS Design Contest Encourages Advances in MEMS Technology

03/16/2016  Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest is being launched at DATE 2016.




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WEBCASTS



Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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