LEDs

LEDS ARTICLES



Consider packaging requirements at the beginning, not the end, of the design cycle

04/02/2015  Consider these eight issues where the packaging team should be closely involved with the circuit design team.

Southeast Asia to spend $19B for semiconductor equipment and materials by 2016

04/02/2015  Programme information is now available on the inaugural SEMICON Southeast Asia, which will run from 22–24 April at SPICE in Penang.

Advanced analytics for yield improvement and zero defect in semiconductors

04/02/2015  Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Solving molybdenum disulfide's 'thin' problem

03/27/2015  Research team increases material's light emission by twelve times.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

LEDs Taiwan opens today in Taipei

03/25/2015  LED Taiwan, opening today at TWTC Nangang Exhibition Hall in Taipei, is Taiwan's only LED manufacturing-focused exposition.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

Seoul Semiconductor introduces new modules based on Acrich3 technology

03/24/2015  Seoul Semiconductor, a developer of LED technology, announced the availability of new Acrich3 modules for a wide range of residential and commercial lighting applications.

UW scientists build a nanolaser using a single atomic sheet

03/24/2015  University of Washington scientists have built a new nanometer-sized laser -- using the thinnest semiconductor available today -- that is energy efficient, easy to build and compatible with existing electronics.

2014 top MEMS players ranking: Rising of the first MEMS titan

03/24/2015  With an impressive 20 percent growth in MEMS revenue compared to 2013, and sales revenues of more than $1.2B, Robert Bosch GmbH is the clear #1.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

03/24/2015  Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

Cambridge Nanotherm publishes results of first independent test of thermal management substrates for LEDs

03/19/2015  The tests were conducted by The LIA Laboratories (part of The LIA - Europe’s largest lighting trade association) and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.

The promising future of LEDs

03/19/2015  In 2015, companies are not relying on more technical breakthroughs, except at the LED module level, where integration remains an important issue.

Poised for more growth

03/17/2015  Strong fab equipment spending expected in 2015; Slower but positive 2016.

Soraa appoints new Product Development Senior VP

03/17/2015  Soraa, a developer of GaN on GaN LED technology, announced today that Ann Reo has joined the company as Senior Vice President of Product Development.

Recovering economies driving growth in the industrial semiconductor market

03/16/2015  The industrial semiconductor market will post a 9.7 percent compound annual growth rate (CAGR) over the next several years as revenue rises from $34.8 billion in 2013 to $55.2 billion in 2018.

Light sensors market to grow 16 percent between 2013 and 2016

03/13/2015  Samsung, Apple and Chinese OEMs will drive revenue in the light sensor market to grow 16 percent between 2013 and 2016, according to a new report released today from IHS Inc.

Marktech Optoelectronics adds miniature Point Source LED packages to product lineup

03/11/2015  Marktech Optoelectronics Corp. announces the addition of a PLCC-4 and miniature ceramic package to the 650nm and 850nm Point Source LED series.

Strong fab equipment spending expected in 2015; Slowing but positive 2016

03/10/2015  SEMI today announced an update of the SEMI World Fab Forecast report which updates outlooks for 2015 and 2016.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Sensor Fusion and the Role of MEMS in IoT

Thursday May 28, 2015 at 1:00 p.m. EST

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015